Abstract

The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating …

Legal parties

Party
Inventors (applicants): Yun-Hwan Jo, Hyun-Joon Song, Kwi-Jong Lee, Jung-Up Bang, Dong-Hoon Kim, Hyuck-Mo Lee, Ji-Chan Park
Assignees (initial): Samsung Electro-Mechanics Co., Ltd. KR
Agents: McDermott Will & Emery LLP (attorney)

The application was examined by Mark Kopec (USPTO dept. 1761), Haidung Nguyen

Claims

  • 1. A method for manufacturing alloy nanoparticles comprising: …
  • 2. The method of claim 1 , further comprising forming Sn—Cu—Ag alloy nanoparticles by adding …
  • 3. The method of claim 1 , wherein the solvent is at least one alcohol …

International priority data

KR: 10-2008-0078611 / Aug. 11, 2008 (national)

Cited documents

Patents

  • JP 2003-321702, Nov. 1, 2003
  • WO WO 2008/001741, Jan. 1, 2008
  • JP 2004-266176, Sep. 1, 2004
  • JP 2003-321702 A, Nov. 1, 2003
  • WO WO 2006/019144, Feb. 1, 2006
  • KR 10-2008-0010691, Jan. 1, 2008

Drawings

Brief Description of the Drawings

FIG. 1 is a flow chart illustrating a method of manufacturing alloy nanoparticles according to an embodiment of the invention. FIG. 2 is a flow chart illustrating a method of manufacturing …

Description

Background

1. Technical Field The present invention relates to Sn—Cu—Ag alloy nanoparticles, a preparation method thereof and ink or paste using the alloy nanoparticles. 2. Description of the Related Art Nanoparticles …

Cross-Reference to Related Applications

This application is a Divisional of U.S. application Ser. No. 12/437,945, filed on May 8, 2009, now abandoned which claims the benefit of Korean Patent Application No. 10-2008-0078611 filed …

Detailed Description

When copper is formed into nanoparticles, the surface of nanoparticles gets too easily oxidized due to increased surface area and such oxidation causes the formation of oxidation layer which further …

More details about Alloy Nanoparticles of SN-CU-AG, Preparation Method Thereof and Ink or Paste Using the Alloy Nanoparticles

Miscellaneous patent data

The agent's company name is McDermott Will & Emery LLP, the claim number 1 is selected as exemplary, numbered 13/495,887 (application), the patent was granted on Jul. 30, 2013, the invention is titled Alloy Nanoparticles of SN-CU-AG, Preparation Method Thereof and Ink or Paste Using the Alloy Nanoparticles, the assignee is categorized as a foreign company or corporation, the patent is illustrated by 5 drawings, similar classification categories are titanium or zirconium, containing manganese, melting, Vanadium Base, silicon as the next major constituent, Cadmium, lead, or bismuth containing, Aluminum containing, Rare Earth Metal Base Singly or in Combination, Nitrides, Rare earth containing, the recorded applicant's name is Park Ji-Chan, originally classified under Copper containing, the published assignee company is Samsung Electro-Mechanics Co., Ltd., the exemplary patent drawings are Differential scanning calorimetry (DSC) analysis, Flow chart illustrating a method, Alloy Nanoparticles of SN-CU-AG, Preparation, Transmission electron microscopy (TEM) result, claims 1-11 comprise the invention scope, the published inventor's name is Yun-Hwan Jo, the application was examined by Mark Kopec, the assistant examiner Haidung Nguyen (1761 USPTO department), invented by Ji-Chan Park et al., the patent particularly claims a method for manufacturing alloy nanoparticles comprising…, the invention details are shown in 5 figures, the grant number is 08496873, the application publication date is Jun. 13, 2012.

Invention classification information

The invention is classified under Copper containing, Sn-base component, Tin Base, Next to Group IB metal-base component, Tin compound, Alloys based on tin, Metal compound containing. The designated search classifications include Tin Base, Copper containing, Metal compound containing, Tin compound, Next to Group IB metal-base component, Sn-base component.

Patent details
Publication number 08496873
Publication date Jul. 30, 2013
Kind code B2
Application number 13/495,887
Application date Jun. 13, 2012
Application type U
Application series code 13
National classification 420/560
Total number of claims 11
Exemplary claims 1
Number of drawings 5
Number of figures 5
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