Featured patents

Double-Side Polishing Apparatus
US 08834234 B2, Sept. 16, 2014, Opposed abrading tools, Kazuya Sato et al. / Shin-Etsu Handotai Co., Ltd. (Tokyo, JP)
A double-side polishing apparatus comprising at least:…

Grinding Method of Multifunction Grinding Machine
US 08851957 B2, Oct. 7, 2014, With feeding of tool or work holder, Toshiaki Naya et al. / JTEKT Corporation (Osaka-shi, JP)
A grinding method of a multifunction grinding machine grinding predetermined…

Chemical Mechanical Polisher and Polishing Pad Component Thereof
US 08845398 B2, Sept. 30, 2014, Tool Support for Flexible-Member Tool, Feng Chen / Semiconductor Manufacturing International (Shanghai) Corporation (Shanghai, CN
A chemical mechanical polisher, comprising a polishing platen having a flat…

Fluid/Abrasive Jet Cutting Arrangement
US 08834232 B2, Sept. 16, 2014, By blasting, Joshua Liwszyc et al. / Abrasive Cutting Technology Ltd. (Dublin, IE)
A high pressure cutting arrangement comprising a liquid stream and a slurry…

Skate Sharpening Holder, Skate Blade, and Method of Use
US 08827768 B2, Sept. 9, 2014, Abrading Process, Robert H. Allen
In a skate sharpening holder having an anvil plate and a clamping assembly…

Multi-Carriage Symmetrical Numerically Controlled Coordinate Grinding Machine
US 08784155 B2, July 22, 2014, Computer controlled, Tianrun Guo et al.
A multi-carriage symmetrical NC coordinate grinding machine, comprising a base,…

Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
US 08715035 B2, May 6, 2014, By optical sensor, Sudhanshu Misra et al. / NexPlanar Corporation (Hillsboro, US)
An article comprising a unitary polishing pad for polishing a substrate, said pad…

Method of Manufacturing Semiconductor Device
US 08668553 B2, March 11, 2014, Glass or stone abrading, Hayato Korogi / Panasonic Corporation (Osaka, JP)
A method for manufacturing a semiconductor device, comprising step of:…

Cutting Method and Cutting Device for Hard Material
US 08662959 B2, March 4, 2014, Abrading Process, Yasuo Yamane et al. / Toshiba Kikai Kabushiki Kaisha (Tokyo, JP)
A method of cutting a workpiece made of a highly hard material, comprising…

Chemical Mechanical Polishing Method and System
US 08602838 B2, Dec. 10, 2013, Computer controlled, Tsung-Hsuan Ho et al. / Mcronix International Co., Ltd. (Hsin-chu, TW)
A method of chemical mechanical polishing, comprising steps of:…

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