Featured patents

Method of Making Surface Mount Stacked Semiconductor Devices
US 08853058 B2, Oct. 7, 2014, With attachment to temporary support or carrier, Navas Khan Oratti Kalandar et al. / Freescale Semiconductor, Inc. (Austin, US)
A method of making surface mount semiconductor devices, comprising:…

Method of Fabricating a Neutron Detector Such as a Microstructured Semiconductor Neutron Detector
US 08778715 B2, July 15, 2014, Responsive to corpuscular radiation, Ryan G. Fronk et al. / Radiation Detection Technologies, Inc. (Manhattan, US)
A method of making a neutron detector, the method comprising:…

Methods for Encapsulating Nanocrystals and Resulting Compositions
US 08697471 B2, April 15, 2014, Packaging or treatment of packaged semiconductor, Robert S. Dubrow / Nanosys, Inc. (Milpitas, US)
A method of hermetically sealing one or more compositions comprising a plurality…

Method for Reducing the Concentration of Oxygen, Carbon, and Silicon Impurities on Nitrogen-Polar Surfaces of Gallium Nitride
US 08669168 B1, March 11, 2014, Fluid growth from gaseous state combined with preceding diverse operation, Glenn G. Jernigan et al. / The United States of America, as represented by the Secretary of the Navy (Washington, US)
A method of preparing GaN material, the method comprising:…

Integrated Circuit Contact Structure and Method
US 08580628 B2, Nov. 12, 2013, Having insulated gate, André P. Labonté et al. / GLOBALFOUNDRIES, Inc. (Grand Cayman, KY)
A method for forming an integrated circuit (40) with a mis-alignment tolerant…

Multilevel Interconnect Structures and Methods of Fabricating Same
US 08586470 B2, Nov. 19, 2013, Contacting multiple semiconductive regions, Marco Bonifacio et al. / STMicroelectronics S.r.l. (Agrate Brianza (MB), IT
A method for fabricating a multilevel interconnect structure with a first…

Methods for Fabricating Integrated Circuits
US 08541286 B2, Sept. 24, 2013, Refilling multiple grooves of different widths or depths, Chang Seo Park / GLOBALFOUNDRIES, Inc. (Grand Cayman, KY)
A method for fabricating an integrated circuit comprising:…

Deposition Method and Method for Manufacturing Semiconductor Device
US 08518761 B2, Aug. 27, 2013, Having insulated gate, Shunpei Yamazaki et al. / Semiconductor Energy Laboratory Co., Ltd. (Atsugi-shi, Kanagawa-ken, JP)
A method for manufacturing a semiconductor device comprising the steps of:…

Polishing Liquid for Metal Film and Polishing Method
US 08501625 B2, Aug. 6, 2013, Utilizing particulate abradant, Jin Amanokura et al. / Hitachi Chemical Co., Ltd. (Tokyo, JP)
A polishing liquid for metal film comprising 7.0% by weight or more up to 20…

Method of Separating Nitride Films From the Growth Substrates by Selective Photo-Enhanced Wet Oxidation
US 08481353 B2, July 9, 2013, Compound semiconductor, Po-Chun Yeh et al. / Opto Tech Corporation (Hsinchu, TW)
A method comprising:…

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