Featured patents

Reducing Variation by Using Combination Epitaxy Growth
US 08828850 B2, Sept. 9, 2014, Formation of Semiconductive Active Region on Any Substrate, Yi-Hung Lin et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method comprising:…

Manufacturing Method for Semiconductor Device
US 08822239 B2, Sept. 2, 2014, Including Control Responsive to Sensed Condition, Nobuaki Hashimoto / Seiko Epson Corporation JP
A manufacturing method for semiconductor device, comprising:…

Method of Impurity Introduction and Controlled Surface Removal
US 08828854 B2, Sept. 9, 2014, Plasma, Tzu-Yin Chiu
A method of introducing dopants into a semiconductor wafer, the method…

Silk-Screen Stencil for Printing Onto a Photovoltaic Cell
US 08802487 B2, Aug. 12, 2014, Contact formation, Frédéric Barbier et al. / Commissariat a l'energie Atomique et aux Energies Alternatives (Paris, FR)
Stencil for a screen-printing system, comprising slits (22, 23) in a central…

High Performance Strained Source-Drain Structure and Method of Fabricating the Same
US 08709897 B2, April 29, 2014, Utilizing compound semiconductor, Hsueh-Chang Sung et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method comprising:…

Creation of Vias and Trenches With Different Depths
US 08703604 B2, April 22, 2014, Having viaholes of diverse width, Shom Ponoth et al. / International Business Machines Corporation (Armonk, US)
A method comprising:…

Semiconductor Devices and Methods of Manufacture Thereof
US 08722473 B2, May 13, 2014, Plural gate electrodes, Hongfa Luan et al. / Infineon Technologies AG (Neubiberg, DE)
A method of manufacturing a semiconductor device, the method comprising:…

Micro-Electro-Mechanical-System Device With Particles Blocking Function and Method for Making Same
US 08664099 B2, March 4, 2014, Including heat treatment, Chuan Wei Wang et al. / PixArt Imaging Incorporation, R.O.C. (Hsin-Chu, TW)
A MEMS device with particles blocking function, comprising:…

Devices With Gate-To-Gate Isolation Structures and Methods of Manufacture
US 08455330 B2, June 4, 2013, And deposition of polysilicon or noninsulative material into groove, Brent A. Anderson et al. / International Business Machines Corporation (Armonk, US)
A method, comprising:…

Manufacturing Method and Manufacturing Apparatus of Semiconductor Device
US 08445359 B2, May 21, 2013, Subsequent separation into plural bodies, Koichiro Tanaka et al. / Semiconductor Energy Laboratory Co., Ltd. (Atsugi-shi, Kanagawa-ken, JP)
A manufacturing apparatus comprising:…

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