Featured patents

High Throughput Epitaxial Lift Off for Flexible Electronics
US 08796120 B2, Aug. 5, 2014, Formation of Semiconductive Active Region on Any Substrate, Cheng-Wei Cheng et al. / International Business Machines Corporation (Armonk, US)
A method of releasing a semiconductor device layer from a base substrate, said…

Method for Positioning Spacers in Pitch Multiplication
US 08865598 B2, Oct. 21, 2014, Utilizing multilayered mask, Sanket Sant et al. / Micron Technology, Inc. (Boise, US)
A method for forming an integrated circuit, comprising:…

Non-Volatile Semiconductor Storage Device and Method of Manufacturing the Same
US 08728919 B2, May 20, 2014, Formation of Semiconductive Active Region on Any Substrate, Masaru Kidoh et al. / Kabushiki Kaisha Toshiba (Tokyo, JP)
A method of manufacturing a non-volatile semiconductor storage device having…

Vacuum Processing Method and Vacuum Processing Apparatus
US 08652970 B2, Feb. 18, 2014, With substrate heating or cooling, Kyuzo Nakamura et al. / Ulvac, Inc. (Kanagawa, JP)
A vacuum processing method, comprising:…

Patterned Glass Cylindrical Lens Arrays for Concentrated Photovoltaic Systems, And/Or Methods of Making the Same
US 08609455 B2, Dec. 17, 2013, Having additional optical element, Willem den Boer et al. / Guardian Industries Corp. (Auburn Hills, US)
A method of making a solar photovoltaic module, the method comprising:…

Method of Making Semiconductor Optical Integrated Device by Alternately Arranging Spacers With Integrated Device Arrays
US 08563342 B2, Oct. 22, 2013, Optical waveguide structure, Kenji Hiratsuka et al. / Sumitomo Electric Industries Ltd. (Osaka, JP)
A method of making a semiconductor optical integrated device comprising the steps…

Method of Manufacturing Semiconductor Device Including Insulated Gate Bipolar Transistor and Diode
US 08507352 B2, Aug. 13, 2013, Including diode, Masaki Koyama et al. / DENSO CORPORATION (Kariya, JP)
A method of manufacturing a semiconductor device including an IGBT forming region…

Method of Manufacturing Semiconductor Device
US 08476124 B2, July 2, 2013, Introduction of nondopant into semiconductor layer, Junji Oh / Fujitsu Semiconductor Limited (Yokohama, JP)
A method of manufacturing a semiconductor device comprising:…

Method for Fabricating Active-Matrix Display Device
US 08465994 B2, June 18, 2013, Making emissive array, Tae-Sung Kim / Samsung Display Co., Ltd. (Yongin, KR)
A method for fabricating a display device having a plurality of gate lines…

Monolithic IC and MEMS Microfabrication Process
US 08445307 B2, May 21, 2013, Having cantilever element, David M Bloom et al. / Alces Technology, Inc. (Jackson, US)
A microfabrication process comprising the following steps, in sequence:…

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