Featured patents

Semiconductor Package Having Buried Post in Encapsulant and Method of Manufacturing the Same
US 08846446 B2, Sept. 30, 2014, Assembly of plural semiconductive substrates each possessing electrical device, Teak-Hoon Lee et al. / Samsung Electronics Co., Ltd. (Yeongtong-gu, Suwon-si, Gyeonggi-do, KR)
A method of forming a semiconductor device, the method comprising:…

Reduction of Pore Fill Material Dewetting
US 08871632 B2, Oct. 28, 2014, Contacting multiple semiconductive regions, Teddie P. Magbitang et al. / International Business Machines Corporation (Armonk, US)
A program storage device readable by a machine, tangibly embodying a program…

Group III Nitride Substrate, Semiconductor Device Comprising the Same, and Method for Producing Surface-Treated Group III Nitride Substrate
US 08871647 B2, Oct. 28, 2014, Planarization by etching and coating, Keiji Ishibashi / Sumitomo Electric Industries, Ltd. (Osaka-shi, Osaka, JP)
A method for manufacturing a surface-treated group III nitride substrate,…

Method for Manufacturing Semiconductor Device
US 08759132 B2, June 24, 2014, Making emissive array, Hajime Kimura et al. / Semiconductor Energy Laboratory Co., Ltd. (Atsugi-shi, Kanagawa-ken, JP)
A method for manufacturing a semiconductor device comprising a pixel portion…

Resin Application Apparatus, Optical Property Correction Apparatus and Method, and Method for Manufacturing LED Package
US 08679865 B2, March 25, 2014, Packaging or treatment of packaged semiconductor, Sang Hoon Lee et al. / Samsung Electronics Co., Ltd. (Seoul, KR)
An LED package manufacturing method for an LED package array comprising…

Method of Manufacturing Layered Chip Package
US 08652877 B2, Feb. 18, 2014, Stacked array, Hiroshi Ikejima et al. / Headway Technologies, Inc. (Milpitas, US)
A method of manufacturing a plurality of layered chip packages, each…

Method for Manufacturing Solid-State Imaging Device
US 08574941 B2, Nov. 5, 2013, Making Device or Circuit Responsive to Nonelectrical Signal, Tomoyuki Hirano et al. / Sony Corporation JP
A method for manufacturing a solid-state imaging device in which a charge…

Power Semiconductor Device Package and Fabrication Method
US 08563360 B2, Oct. 22, 2013, Using strip lead frame, Jun Lu et al. / Alpha and Omega Semiconductor, Inc. (Sunnyvale, US)
A method of fabricating a power semiconductor device package comprising the steps…

Methods of Forming Electrical Contacts
US 08518812 B2, Aug. 27, 2013, Forming array of gate electrodes, Micaela Gabriella Tomasini et al. / Micron Technology, Inc. (Boise, US)
A method of forming a contact, comprising:…

Method for Growing Semipolar Nitride
US 08524583 B2, Sept. 3, 2013, Differential etching, Hsueh-Hsing Liu et al. / National Central University (Jung-li, Taoyuan, TW)
A method for growing a semipolar nitride, comprising steps:…

Patentorg has 8395 documents under Semiconductor Device Manufacturing: Process Patents.

Narrow down the browsing criteria below to see more patents.

Select a subcategory
Quick navigation
New documents
  • Process for the Production of the Actinobacillus Pleuropneumoniae Toxins APXI or APXIII in a Liquid Culture Medium Under Supply of Air Enriched in Carbon Dioxide
  • Method for Manufacturing Nonvolatile Memory Device
  • Supply Chain Demand Satisfaction
  • Supply-Line Management Device
  • Storage Control Device and Method for Managing Snapshot