Featured patents

Defect-Free Junction Formation Using Octadecaborane Self-Amorphizing Implants
US 08815719 B2, Aug. 26, 2014, Plasma, Jiping Li et al. / Applied Materials, Inc. (Santa Clara, US)
A method of treating a substrate, comprising:…

High Density Serial Capacitor Device and Methods of Making Such a Capacitor Device
US 08809149 B2, Aug. 19, 2014, Plural gate electrodes, Tony Joung et al. / GLOBALFOUNDRIES Inc. (Grand Cayman, KY)
A method, comprising:…

MEMS Structure With Adaptable Inter-Substrate Bond
US 08748205 B1, June 10, 2014, Making Device or Circuit Responsive to Nonelectrical Signal, Jiou-Kang Lee et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method for forming a MEMS device comprising:…

Laser Crystallization System and Method of Manufacturing Display Apparatus Using the Same
US 08673751 B2, March 18, 2014, Simultaneous single crystal formation, Young-Jin Chang et al. / Samsung Display Co., Ltd. (Gyeonggi-Do, KR)
A method of manufacturing a display apparatus, the method comprising:…

Process for Fabricating Semiconductor Devices and a Semiconductor Device Comprising a Chip With Through-Vias
US 08586450 B2, Nov. 19, 2013, Bonding of Plural Semiconductor Substrates, Eric Saugier / STMicroelectronics (Grenoble 2) SAS (Grenoble, FR
A process for fabricating a semiconductor device, comprising:…

Reduction of Forming Voltage in Semiconductor Devices
US 08551809 B2, Oct. 8, 2013, Having Metal Oxide or Copper Sulfide Compound Semiconductor Component, Yun Wang et al. / Intermolecular, Inc. (San Jose, US)
A method of fabricating a memory cell, the method comprising:…

Method for Fabricating a Semiconductor Device
US 08530316 B2, Sept. 10, 2013, Having elevated source or drain, Chii-Horng Li et al. / Taiwan Semiconductor Manufacturing Company, Ltd. TW
A method for fabricating a semiconductor device, comprising:…

Method for Manufacturing Light Emitting Diode by Etching With Alkaline Solution
US 08501514 B2, Aug. 6, 2013, Tapered etching, Tzu-Chien Hung et al. / Advanced Optoelectronic Technology, Inc. (Hsinchu Hsien, TW)
A method for manufacturing an LED comprising:…

SOI Substrate and Manufacturing Method Thereof
US 08476147 B2, July 2, 2013, Subsequent separation into plural bodies, Hajime Tokunaga et al. / Semiconductor Energy Laboratory Co., Ltd. (Kanagawa-ken, JP)
A method for manufacturing an SOI substrate, comprising the steps of:…

Semiconductor Device and Method of Manufacturing the Same
US 08445350 B2, May 21, 2013, Dielectric isolation formed by grooving and refilling with dielectric material, Dong Hee Han / Hynix Semiconductor, Inc. (Icheon, KR)
A method of manufacturing a semiconductor device, the method comprising:…

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