Featured patents

Fabrication Method for Embedded Magnetic Memory
US 08772051 B1, July 8, 2014, Having Magnetic or Ferroelectric Component, Kenlin Huang et al. / Headway Technologies, Inc. (Milpitas, US)
A method of fabricating an embedded memory device comprising:…

Method of Manufacturing Variable Resistance Memory Device
US 08735215 B2, May 27, 2014, Having Selenium or Tellurium Elemental Semiconductor Component, Hyo-Jung Kim et al. / Samsung Electronics Co., Ltd. (Suwon-si, KR)
A method of manufacturing a variable resistance memory device, comprising:…

Transparent Conductive Electrode Stack Containing Carbon-Containing Material
US 08741678 B2, June 3, 2014, Making emissive array, Tze-Chiang Chen et al. / International Business Machines Corporation (Armonk, US)
A method of forming a transparent conductive electrode stack comprising:…

Aluminum Alloy Lead-Frame and Its Use in Fabrication of Power Semiconductor Package
US 08703545 B2, April 22, 2014, Lead frame, Zhiqiang Niu et al. / Alpha & Omega Semiconductor, Inc. (Sunnyvale, US)
A method for preparing a power semiconductor package using an aluminum alloy…

Semiconductor Processing Methods
US 08617975 B2, Dec. 31, 2013, To form ohmic contact to semiconductive material, Richard L. Stocks et al. / Micron Technology, Inc. (Boise, US)
A semiconductor processing method, comprising:…

Semiconductor Device and Manufacturing Method Thereof
US 08574976 B2, Nov. 5, 2013, Doping of semiconductor channel region beneath gate insulator, Naoto Kusumoto et al. / Semiconductor Energy Laboratory Co., Ltd. (Atsugi-shi, Kanagawa-ken, JP)
A method of manufacturing a semiconductor device comprising the steps of:…

Densely-Packed Films of Lanthanide Oxide Nanoparticles via Electrophoretic Deposition
US 08524613 B1, Sept. 3, 2013, Insulative material deposited upon semiconductive substrate, Sameer V. Mahajan et al. / Vanderbilt University (Nashville, US)
A method of forming a film of lanthanide oxide nanoparticles, comprising…

Method of Forming an Interconnect Structure Having an Enlarged Region
US 08513115 B2, Aug. 20, 2013, With formation of opening in insulative layer, Chien-Jung Wang / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method of forming an interconnect structure, the method comprising:…

Multiple Seal Ring Structure
US 08461021 B2, June 11, 2013, Having specified scribe region structure, Jen-Shyan Lin et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method of fabricating a semiconductor device, the method comprising:…

Trench Process and Structure for Backside Contact Solar Cells With Polysilicon Doped Regions
US 08460963 B2, June 11, 2013, Responsive to electromagnetic radiation, David D. Smith / SunPower Corporation (San Jose, US)
A method of fabricating a solar cell, the method comprising:…

Patentorg has 8395 documents under Semiconductor Device Manufacturing: Process Patents.

Narrow down the browsing criteria below to see more patents.

Select a subcategory
Quick navigation
New documents
  • Process for the Production of the Actinobacillus Pleuropneumoniae Toxins APXI or APXIII in a Liquid Culture Medium Under Supply of Air Enriched in Carbon Dioxide
  • Method for Manufacturing Nonvolatile Memory Device
  • Supply Chain Demand Satisfaction
  • Supply-Line Management Device
  • Storage Control Device and Method for Managing Snapshot