Featured patents

Nano-Crystal Etch Process
US 08809198 B2, Aug. 19, 2014, Electrically conductive material, Paul Morgan et al. / Micron Technology, Inc. (Boise, US)
A method for selectively removing nano-crystals comprising:…

Method of Double-Sided Patterning
US 08772125 B2, July 8, 2014, Having substrate registration feature, Lei Wang et al. / Shanghai Hua Hong Nec Electronics Co., Ltd. (Shanghai, CN)
A method of double-sided patterning, comprising, in the following order,…

Disabling Electrical Connections Using Pass-Through 3D Interconnects and Associated Systems and Methods
US 08772086 B2, July 8, 2014, Stacked array, Russell D. Slifer et al. / Micron Technology, Inc. (Boise, US)
A microelectronic workpiece, comprising:…

Solid Element Device and Method for Manufacturing the Same
US 08685766 B2, April 1, 2014, Packaging or treatment of packaged semiconductor, Mitsuhiro Inoue et al. / Toyoda Gosei Co., Ltd. (Nishikasugai-Gun, Aichi-Ken, JP)
A method of making a solid element device that comprises:…

Method of Manufacturing Film for Semiconductor Device
US 08658515 B2, Feb. 25, 2014, With attachment to temporary support or carrier, Koichi Inoue et al. / Nitto Denko Corporation (Osaka, JP)
A method of manufacturing a film for a semiconductor device in which a dicing…

Method for the Production of an Electronic Component and Electronic Component Produced According to This Method
US 08586418 B2, Nov. 19, 2013, Possessing thermal dissipation structure, Dag Behammer et al. / United Monolithic Semiconductors GmbH (Ulm, DE)
Method for the production of an electronic component having at least one…

Semiconductor Device Contacts
US 08563434 B2, Oct. 22, 2013, Electroless deposition of conductive layer, Fabrice Dierre et al. / Kromek Limited (Durham, GB)
A method of fabrication of contacts on a semiconductor material comprising…

Integrated Circuit Package-On-Package System With Underfilling Structures and Method of Manufacture Thereof
US 08535981 B2, Sept. 17, 2013, Stacked array, SeungYun Ahn et al. / Stats Chippac Ltd. (Singapore, SG)
A method of manufacture of an integrated circuit packaging system comprising:…

Structure for Nano-Scale Metallization and Method for Fabricating Same
US 08492270 B2, July 23, 2013, With formation of opening in insulative layer, Elbert E Huang et al. / International Business Machines Corporation (Armonk, US)
A method of forming a structure aligned with features underlying an opaque layer,…

Transistor Assembly and Method for Manufacturing the Same
US 08450146 B2, May 28, 2013, Having Diamond Semiconductor Component, Masahiro Hikita et al. / Panasonic Corporation (Osaka, JP)
A method for manufacturing a transistor assembly, comprising the steps of:…

Patentorg has 8395 documents under Semiconductor Device Manufacturing: Process Patents.

Narrow down the browsing criteria below to see more patents.

Select a subcategory
Quick navigation
New documents
  • Process for the Production of the Actinobacillus Pleuropneumoniae Toxins APXI or APXIII in a Liquid Culture Medium Under Supply of Air Enriched in Carbon Dioxide
  • Method for Manufacturing Nonvolatile Memory Device
  • Supply Chain Demand Satisfaction
  • Supply-Line Management Device
  • Storage Control Device and Method for Managing Snapshot