Featured patents

High-Temperature Lead-Free Solder Alloy
US 08865062 B2, Oct. 21, 2014, Rei Fujimaki et al. / Senju Metal Industry Co., Ltd. (Tokyo, JP)
A high-temperature lead-free solder alloy consisting essentially of 35-40 mass %…

Lead-Free Solder Alloy
US 08691143 B2, April 8, 2014, Tsukasa Ohnishi et al. / Senju Metal Industry Co., Ltd. (Tokyo, JP)
A lead-free solder alloy consisting of, in mass percent, Ag: 0.8-2.0%, Cu:…

Solder Alloy, Solder Ball and Electronic Member Having Solder Bump
US 08501088 B2, Aug. 6, 2013, Masamoto Tanaka et al. / Nippon Steel & Sumikin Materials Co., Ltd. (Tokyo, JP)
A solder alloy comprising:…

Patentorg has 3 documents under Antimony, or Bismuth Containing Patents.

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