Featured patents

Broad-Area Edge-Emitting Semiconductor Laser With Limited Thermal Contact
US 08446926 B2, May 21, 2013, Kenneth D. Scholz et al. / Coherent, Inc. (Santa Clara, US)
A diode laser package comprising:…

Compression Mount for Semiconductor Devices, and Method
US 08681829 B2, March 25, 2014, Robert E. Grove / Intellectual Light, Inc. (Pleasanton, US)
Apparatus for providing electrical energy to and dissipating thermal energy…

Cooling Apparatus for Optically Pumped Semiconductor Laser
US 08804783 B2, Aug. 12, 2014, Charles King et al. / Coherent, Inc. (Santa Clarent, US)
Apparatus, comprising:…

Heat Sink and Assembly or Module Unit
US 08559475 B2, Oct. 15, 2013, Jürgen Schulz-Harder et al. / Curamik Electronics GmbH (Eschenbach, DE)
An assembly or module unit comprising:…

Heat Transfer Device With at Least One Semiconductor Element, Particularly a Laser or Light-Emitting Diode Element, and Method for the Assembly Thereof
US 08649405 B2, Feb. 11, 2014, Matthias Schröder et al. / Jenoptik Laser GmbH (Jena, DE)
A Heat transfer device comprising:…

High Reliability Laser Emitter Modules
US 08644357 B2, Feb. 4, 2014, Edmund L. Wolak et al. / II-VI Incorporated (Saxonburg, US)
An optical module or subassembly thereof, comprising:…

High-Power Semiconductor Laser and Method for Manufacturing the Same
US 08638827 B2, Jan. 28, 2014, XingSheng Liu / XI'AN Focuslight Technologies Co., Ltd (Xi'an, Shaanxi Province, CN)
A high-power single emitter semiconductor laser, comprising a support shoe,…

Laser Diode Structure With Integrated Temperature-Controlled Beam Shaping Element and Method for Gas Detection by Means of a Laser Diode Structure
US 08594143 B2, Nov. 26, 2013, Mathieu Gaillard et al. / Axetris AG (Kagiswil, CH)
A gas detection laser diode structure with a hermetically sealed housing…

Laser Emitter Modules and Methods of Assembly
US 08553737 B2, Oct. 8, 2013, Serge Cutillas et al. / Oclaro Photonics, Inc. (San Jose, US)
A ferrule assembly for positioning an input surface of an optical fiber,…

Laser Light Source Device
US 08553738 B2, Oct. 8, 2013, Shinichi Oe et al. / Mitsubishi Electric Corporation (Chiyoda-Ku, Tokyo, JP)
A laser light source device, comprising:…

Light Source Device
US 08724668 B2, May 13, 2014, Toru Yoshihara et al. / Mitsubishi Electric Corporation (Tokyo, JP)
A light source device having a plurality of laser modules, in each…

Means for Improved Implementation of Laser Diodes and Laser Diode Arrays
US 08660157 B2, Feb. 25, 2014, Michael A. Huff et al. / Corporation for National Research Initiatives (Reston, US)
A method of bonding a semiconductor substrate to a metal substrate without…

Method and Apparatus for Cooling a Fiber Laser or Amplifier
US 08467426 B2, June 18, 2013, John Schroeder et al. / Raytheon Company (Waltham, US)
A system for cooling an optical fiber, the system comprising:…

Method and Apparatus for Cooling Semiconductor Pumped Lasers
US 08660155 B2, Feb. 25, 2014, Peter A. Ketteridge / BAE Systems Information and Electronics Systems Integration Inc. (Nashua, US)
A laser system comprising:…

Method and System for Powering and Cooling Semiconductor Lasers
US 08660156 B2, Feb. 25, 2014, Anthony S. Ladran et al. / Lawrence Livermore National Security, LLC (Livermore, US)
A semiconductor laser system comprising:…

Methods and Systems for Providing a Low Stress Electrode Connection
US 08787414 B1, July 22, 2014, Aland K. Chin et al. / Science Research Laboratory, Inc. (Somerville, US)
A system comprising:…

Optical Module
US 08774241 B2, July 8, 2014, Akira Nakamura et al. / Mitsubishi Electric Corporation (Chiyoda-Ku, Tokyo, JP)
An optical module comprising:…

Optical Transmitter With Stable Output Wavelength
US 08654804 B2, Feb. 18, 2014, Shogo Amari / Sumitomo Electric Industries, Ltd. (Osaka-shi, JP)
An optical transmitter, comprising:…

Optically-Pumped Surface-Emitting Semiconductor Laser With Heat-Spreading Compound Mirror-Structure
US 08611383 B2, Dec. 17, 2013, Sergei Govorkov et al. / Coherent, Inc. (Santa Clara, US)
A gain-module for an optically-pumped semiconductor laser, comprising:…

Semiconductor Device
US 08625646 B2, Jan. 7, 2014, Harumi Nishiguchi et al. / Mitsubishi Electric Corporation (Tokyo, JP)
A semiconductor device comprising:…

Semiconductor Laser Assembly and Packaging System
US 08811439 B2, Aug. 19, 2014, John J. Callahan et al. / SemiNex Corporation (Peabody, US)
A laser system, comprising:…

Thermal Management System
US 08503494 B2, Aug. 6, 2013, Dawson Yee / Microsoft Corporation (Redmond, US)
A thermal management system for selectively thermally isolating and thermally…

Patentorg has 22 documents under Heat Sink Patents.

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