Featured patents

Laser Scan Speed Calibration
US 08804102 B2, Aug. 12, 2014, With light detector, Gordon Green / Materials Solutions (Worcester, GB)
A method of verifying a scan speed in a laser scanning system of an apparatus…

Method of Measuring the Thickness of a Moving Web
US 08760669 B2, June 24, 2014, Thickness, Michael Kon Yew Hughes et al. / Honeywell ASCa Inc. (Mississauga, CA)
A detector device for contact support of a flexible continuous web being…

Parallelism Measuring System and Method Thereof
US 08743375 B2, June 3, 2014, Position or Displacement, Tao Ding et al. / Shenzhen China Star Optoelectronics Technology Co., Ltd. (Shenzhen, Guangdong, CN)
A parallelism measuring system, comprising:…

Multiple Measurement Techniques Including Focused Beam Scatterometry for Characterization of Samples
US 08699027 B2, April 15, 2014, Of surface reflection, Michael J. Kotelyanskii et al. / Rudolph Technologies, Inc. (Flanders, US)
A method of monitoring a fabrication process comprising:…

Range Finder
US 08638423 B2, Jan. 28, 2014, Of focal point search, Kenji Yamada / Nikon Vision Co., Ltd. (Tokyo, JP)
A distance measuring apparatus comprising:…

Optical Device and Analyzing Apparatus
US 08553220 B2, Oct. 8, 2013, With Raman type light scattering, Kohei Yamada et al. / Seiko Epson Corporation JP
An optical device comprising:…

Micro-Radian Class Line of Sight and Centration Stabilization System
US 08531657 B2, Sept. 10, 2013, Automatic following or aligning while indicating measurement, Frederick B. Koehler et al. / Raytheon Company (Waltham, US)
A laser projection system comprising:…

Displacement Detection Device and Method
US 08514410 B2, Aug. 20, 2013, Position or Displacement, Shinichi Tatsuta et al. / Kabushiki Kaisha Toshiba (Tokyo, JP)
A displacement detection device comprising:…

Surface Inspecting Apparatus and Surface Inspecting Method
US 08493557 B2, July 23, 2013, Inspection of Flaws or Impurities, Shigeru Matsui / Hitachi High-Technologies Corporation (Tokyo, JP)
A surface inspecting method employing a surface inspecting apparatus, the surface…

Multi-Spot Illumination for Wafer Inspection
US 08462329 B2, June 11, 2013, Surface condition, Guoheng Zhao et al. / KLA-Tencor Corp. (Milpitas, US)
An illumination on subsystem configured to provide illumination for wafer…

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