Featured patents

Thin Film Resistor
US 08810355 B2, Aug. 19, 2014, Resistance element coated on base, Van Mieczkowski et al. / Cree, Inc. (Durham, US)
An apparatus comprising:…

Magnetic Nanoclusters
US 08872615 B2, Oct. 28, 2014, Magnetic field or compass, John Vedamuthu Kennedy et al. / Institute of Geological and Nuclear Sciences Limited (Lower Hutt, NZ)
A method for producing a magnetic material, the method comprising the steps of:…

Multilayer Ceramic Substrate and Method for Producing the Same
US 08754742 B2, June 17, 2014, Terminal coated on, Yuichi Iida et al. / Murata Manufacturing Co., Ltd. (Kyoto, JP)
A method for producing a multilayer ceramic substrate, the method comprising…

Resistive Switches
US 08570138 B2, Oct. 29, 2013, Current and / or voltage, Jianhua Yang et al. / Hewlett-Packard Development Company, L.P. (Houston, US)
An apparatus including a resistive switch, the resistive switch comprising:…

Chip Varistor
US 08552831 B2, Oct. 8, 2013, Current and / or voltage, Kaname Ueda et al. / TDK Corporation (Tokyo, JP)
A chip varistor comprising:…

Vialess Integration for Dual Thin Films—thin Film Resistor and Heater
US 08558654 B2, Oct. 15, 2013, Thermistor type, Calvin Leung et al. / STMicroelectronics (Grenoble 2) SAS (Grenoble, FR
A heat-trimmable thin-film resistor comprising:…

Thermistor and Method for Manufacturing the Same
US 08514050 B1, Aug. 20, 2013, Thermistor type, Tadamasa Miura / Murata Manufacturing Co., Ltd. (Nagaokakyo-Shi, Kyoto-fu, JP)
A method for manufacturing a thermistor having a metal base material,…

Dual Thin Film Precision Resistance Trimming
US 08493171 B2, July 23, 2013, Ambient temperature, Chengyu Niu et al. / STMicroelectronics, Inc. (Coppell, US)
A method of forming a trimmable resistance structure in an integrated circuit…

Pressure Transducer Utilizing Non-Lead Containing Frit
US 08482372 B2, July 9, 2013, Strain Gauge Type, Anthony D. Kurtz et al. / Kulite Semiconductor Products, Inc. (Leonia, US)
A leadless sensor mounting method, comprising:…

Co-Fired Multi-Layer Stack Chip Resistor and Manufacturing Method
US 08451085 B1, May 28, 2013, Terminal coated on, Yung Cheng Tsai et al. / Prosperity Dielectrics Co., Ltd. (Taoyuan, TW)
A co-fired multi-layer stack chip resistor, comprising:…

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