Featured patents

Production Method for Electronic Chip Component
US 08839510 B2, Sept. 23, 2014, Assembling to base an electrical component, e.g., capacitor, etc., Kazunori Kunimoto et al. / Murata Manufacturing Co., Ltd. (Kyoto, JP)
A production method for an electronic chip component including an electronic…

Method for Producing Liquid-Ejecting Head
US 08819935 B2, Sept. 2, 2014, Fluid pattern dispersing device making, e.g., ink jet, Yutaka Yamazaki et al. / Seiko Epson Corporation (Tokyo, JP)
A method for producing a liquid-ejecting head including a passage-forming…

Expandable Crack Inhibitor Method
US 08763229 B2, July 1, 2014, Repairing, Kevin J. Dooley et al. / Fatigue Technology, Inc. (Seattle, US)
A method of processing a workpiece, comprising:…

Pouch With a Tube Spout Fitment
US 08745836 B2, June 10, 2014, Assembling or joining, R. Charles Murray / Pouch Pac Innovations, LLC (Sarasota, US)
A process for placing a tube spout fitment within a flexible pouch container,…

Methods for Filling Holes in Printed Wiring Boards
US 08726498 B2, May 20, 2014, By forming conductive walled aperture in base, Chris H. Simon et al. / General Dynamics Advanced Information Systems (Fairfax, US)
A method for filling a hole in a printed wiring board, comprising:…

Method for Making Microstructured Objects
US 08720047 B2, May 13, 2014, Beam lead frame or beam lead device, March Maguire et al. / Hoowaki, LLC (Pendleton, US)
A method for manufacturing a microstructured manufacturing article comprising…

Unitary Biochip Providing Sample-In to Results-Out Processing and Methods of Manufacture
US 08720036 B2, May 13, 2014, Combined manufacture including applying or shaping of fluent material, Richard F. Selden et al. / NetBio, Inc. (Waltham, US)
A method of manufacturing a biochip, said method comprising:…

Assembly Method for Induction Rotors
US 08720041 B2, May 13, 2014, Dynamoelectric machine, Andrew Meyer et al. / Remy Technologies, LLC (Pendleton, US)
A method of assembling an induction rotor, comprising:…

Method for Optimizing Routing Layers and Board Space Requirements for a Ball Grid Array Land Pattern
US 08695212 B2, April 15, 2014, Assembling terminal to base, Kevin L. Seaman et al. / Broad Corporation (Irvine, US)
A method for designing a land pattern for mating an integrated circuit device…

Grill Grabber
US 08479381 B2, July 9, 2013, With work-holder for assembly, Marcus Daley
A vehicle grill lift frame, comprising:…

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