Featured patents

Crosslinkable Dielectrics and Methods of Preparation and Use Thereof
US 08853820 B2, Oct. 7, 2014, Including capacitor component, Silke Annika Koehler et al. / BASF SE (Ludwigshafen, DE)
An electronic device comprising at least one dielectric layer,…

Light-Reflective Conductive Particle, Anisotropic Conductive Adhesive and Light-Emitting Device
US 08796725 B2, Aug. 5, 2014, With housing or contact structure, Shiyuki Kanisawa et al. / Dexerials Corporation (Tokyo, JP)
A light-reflective conductive particle for an anisotropic conductive adhesive…

Light Emitting Device Package
US 08872195 B2, Oct. 28, 2014, With specific housing or contact structure, Yuichiro Tanda et al. / LG Innotek Co., Ltd. (Seoul, KR)
A light emitting device package comprising:…

Solid-State Imaging Device and Control System
US 08735952 B2, May 27, 2014, Photodiodes accessed by FETs, Yoshiharu Kudoh et al. / Sony Corporation (Tokyo, JP)
A solid-state imaging device comprising:…

Electrode Structure and Its Manufacturing Method, and Semiconductor Module
US 08710679 B2, April 29, 2014, Wire contact, lead, or bond, Setsuo Andoh et al. / Hitachi Metals, Ltd. (Tokyo, JP)
An electrode structure comprising:…

Semiconductor Device
US 08513724 B2, Aug. 20, 2013, With high dielectric constant insulator, Shinji Takeoka / Panasonic Corporation (Osaka, JP)
A semiconductor device comprising:…

Light-Emitting Semiconductor Device Having Enhanced Brightness
US RE044429 E1, Aug. 13, 2013, With shaped contacts or opaque masking, Tzer-Perng Chen et al. / Epistar Corporation (Hsinchu, TW)
A light-emitting semiconductor device having enhanced…

Semiconductor Device Having an Oxide Semiconductor Layer
US 08492840 B2, July 23, 2013, Single crystal semiconductor layer on insulating substrate (SOI), Hideomi Suzawa et al. / Semiconductor Energy Laboratory Co., Ltd. (Atsugi-shi, Kanagawa-ken, JP)
A semiconductor device comprising:…

Solid-State Imaging Device, Manufacturing Method Thereof, Electronic Apparatus, and Semiconductor Device
US 08492805 B2, July 23, 2013, Imaging array, Kentaro Akiyama et al. / Sony Corporation JP
A solid-state imaging device comprising:…

LED Module and LED Lighting Device
US 08455892 B2, June 4, 2013, Multi-color emission, Hiroyuki Fukui / Rohm Co., Ltd. (Kyoto, JP)
An LED module comprising:…

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