Featured patents

LED Mounting Substrate and Method of Manufacturing the Same
US 08853728 B2, Oct. 7, 2014, With reflector, opaque mask, or optical element integral with device or device enclosure or package, Akira Sengoku et al. / Toyoda Gosei Co., Ltd. (Kiyosu-Shi, Aichi-Ken, JP)
An LED mounting substrate, comprising:…

Nano-Structured Light-Emitting Devices
US 08835902 B2, Sept. 16, 2014, Incoherent light emitter, Joo-sung Kim et al. / Samsung Electronics Co., Ltd. (Gyeonggi-Do, KR)
A light-emitting device (LED) comprising:…

Light-Emitting Device
US 08809881 B2, Aug. 19, 2014, Multi-color emission, Chi-Hsing Chen et al. / Epistar Corporation (Hsinchu, TW)
A light-emitting device, comprising:…

Sense Amplifier Structure for a Semiconductor Integrated Circuit Device
US 08872277 B2, Oct. 28, 2014, With specified physical layout, Duk Su Chun / SK Hynix Inc. (Gyeonggi-do, KR)
A semiconductor integrated circuit device, comprising:…

Semiconductor Memory Device Using Variable Resistance Element or Phase-Change Element as Memory Device
US 08772748 B2, July 8, 2014, With means to localize region of conduction, Nobuaki Yasutake / Kabushiki Kaisha Toshiba (Minato-ku, JP)
A semiconductor memory device comprising:…

Self-Aligned Double Patterning for Memory and Other Microelectronic Devices
US 08680671 B2, March 25, 2014, Entirely of metal except for feedthrough, Tzu-Yen Hsieh / Spansion LLC (Sunnyvale, US)
A method, comprising:…

Pick-And-Place Tool for Packaging Process
US 08546802 B2, Oct. 1, 2013, Test or Calibration Structure, Yi-Li Hsiao et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
An apparatus comprising:…

Display Device and Method for Manufacturing the Same
US 08519395 B2, Aug. 27, 2013, In array having structure for use as imager or display, or with transparent electrode, Min-Sung Kwon et al. / Samsung Display Co., Ltd. (Yongin-si, KR)
A display device comprising:…

Spin Injection Electrode Structure, Spin Transport Element, and Spin Transport Device
US 08492809 B2, July 23, 2013, With ferroelectric material layer, Tomoyuki Sasaki et al. / TDK Corporation (Tokyo, JP)
A spin injection electrode structure comprising:…

Efficient Pitch Multiplication Process
US 08450829 B2, May 28, 2013, Integrated Circuit Structure With Electrically Isolated Components, Stephen Russell et al. / Micron Technology, Inc. (Boise, US)
A partially fabricated integrated circuit, comprising:…

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