Featured patents

Coiled Tubing With Retainer for Conduit
US 08827140 B2, Sept. 9, 2014, And edge joining of one piece blank or strip, Mark Andreychuk
A method of providing coiled tubing from a strip of metal flat plate comprising…

Method for Manufacturing Substrate
US 08794499 B2, Aug. 5, 2014, Metal to nonmetal with separate metallic filler, Yasuyuki Sekimoto / Murata Manufacturing Co., Ltd. (Kyoto, JP)
A method for manufacturing a substrate, comprising the steps of:…

Methods of Joining Metallic Protective Layers
US 08777090 B2, July 15, 2014, Forming channel, groove, or aperture for reception of filler material, Leonid N. Shekhter et al. / H.C. Starck Inc. (Newton, US)
A method of joining metallic structures, the method comprising:…

Process Control Method
US 08777089 B2, July 15, 2014, Using dynamic frictional energy, Amar M. Varia et al. / Rolls-Royce PLC (London, GB)
A method of controlling a friction welding process in which a component is moved…

Wire Bonding Method
US 08678266 B2, March 25, 2014, With measuring, testing, indicating, inspecting, or illuminating, Tatsunari Mii et al. / Kabushiki Kaisha Shinkawa (Tokyo, JP)
A method of bonding a first bond point to a second bond point…

Joining Method and Device Produced by This Method and Joining Unit
US 08651363 B2, Feb. 18, 2014, Component terminal to substrate surface, Tadatomo Suga et al. / Bondtech, Inc. (Kyoto, JP)
A bonding method for bonding objects to be bonded, each object having a bonding…

Methods and Structures for Forming and Improving Solder Joint Thickness and Planarity Control Features for Solar Cells
US 08636198 B1, Jan. 28, 2014, Component terminal to substrate surface, Ryan Linderman et al. / SunPower Corporation (San Jose, US)
A method for connecting a plurality of solar cells, the method comprising:…

Ultrasonic Bonding Systems and Methods of Using the Same
US 08573468 B1, Nov. 5, 2013, Using high frequency vibratory energy, Christoph B. Luechinger et al. / Orthodyne Electronics Corporation (Irvine, US)
A method of bonding a workpiece, the method comprising the steps of:…

Thermal Conduction Device and Method for Fabricating the Same
US 08453916 B2, June 4, 2013, Bonding nonmetals with metallic filler, Chien-Min Sung et al. / Ritedia Corporation (Hsinchu, TW)
A method for fabricating a thermal conduction device, comprising:…

Board Printing System
US 08448834 B2, May 28, 2013, Work-responsive, Hiroshi Tsuta et al. / Fuji Machine Mfg. Co., Ltd. (Chiryu-shi, JP)
A board printing system comprising:…

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