Featured patents

Selective Solder Stop
US 08740043 B2, June 3, 2014, Using bond inhibiting separating material, Hans-Martin Irslinger / Robert Bosch GmbH (Stuttgart, DE)
A method for producing a surface on a component, the surface having regions…

Printed Board and Bus Bar Assembly
US 08701971 B2, April 22, 2014, By deforming, Masahiro Tagano et al. / Sumitomo Wiring Systems, Ltd. (Mie, JP)
A method of forming a printed board comprising:…

Induction Bonding
US 08701966 B2, April 22, 2014, Work portion comprises electrical component, Michael Nikkhoo et al. / Apple Inc. (Cupertino, US)
An apparatus for positioning a plurality of stranded wires on a printed circuit…

In-Situ Accuracy Control in Flux Dipping
US 08668131 B2, March 11, 2014, By partial or total immersion of work or applicator into liquid, Chen-Hua Yu et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
An apparatus comprising:…

Joining Method and Friction Stir Welding Method
US 08672212 B2, March 18, 2014, Using dynamic frictional energy, Hisashi Hori et al. / Nippon Light Metal Company, Ltd. (Tokyo, JP)
A joining method comprising:…

Vibration Welding System With Thin Film Sensor
US 08672211 B2, March 18, 2014, With measuring, testing, indicating, inspecting, or illuminating, Xiaochun Li et al. / GM Global Technology Operations LLC (Detroit, US)
A vibration welding system comprising:…

System and Method for Terminating Aluminum Conductors
US 08627996 B2, Jan. 14, 2014, Using high frequency vibratory energy, Mike Patrikios / Sonics & Materials Inc. (Newtown, US)
A method for terminating a wire having an aluminum conductor, said method…

Ultrasonic Bonding Systems and Methods of Using the Same
US 08584922 B1, Nov. 19, 2013, Means to Apply Vibratory Solid-State Bonding Energy to Work, Christoph B. Luechinger et al. / Orthodyne Electronics Corporation (Irvine, US)
An ultrasonic bonding system comprising:…

Method for the Quantitative Determination of Soldering Agent Residues
US 08499996 B2, Aug. 6, 2013, With measuring, testing, indicating, inspecting, or illuminating, Hans Koch et al. / Behr GmbH & Co. KG (Stuttgart, DE)
A method for quantitative determination of soldering aid residues which remain…

Automatic Wire Feeding Method for Wire Bonders
US 08459530 B2, June 11, 2013, Wire bonding, Keng Yew James Song et al. / ASM Technology Singapore Pte Ltd (Singapore, SG)
Method of threading an end of a wire through a bonding tool of a wire…

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