Featured patents

Method of Forming Solder on Pad on Fine Pitch PCB and Method of Flip Chip Bonding Semiconductor Using the Same
US 08794502 B2, Aug. 5, 2014, By confining filler, Jung Hyun Noh et al. / Electronics and Telecommunications Research Institute (Daejeon, KR)
A method of forming a solder on pad on a fine pitch PCB, the method…

Apparatus for Adhering Solder Powder and Method for Adhering Solder Powder to Electronic Circuit Board
US 08752754 B2, June 17, 2014, Metal to nonmetal with separate metallic filler, Takekazu Sakai et al. / Showa Denko K.K. (Tokyo, JP)
A method for adhering solder powder to an adhesive portion of an electronic…

Joint With First and Second Members With a Joining Layer Located Therebetween Containing Sn Metal and Another Metallic Material; Methods for Forming the Same Joint
US 08763884 B2, July 1, 2014, Of electrical device, Toshihide Takahashi et al. / Kabushiki Kaisha Toshiba (Tokyo, JP)
A jointing method, comprising:…

Method of Manufacturing an Elongate Insert Made of a Metal Matrix Composite
US 08684255 B2, April 1, 2014, Bonding nonmetals with metallic filler, Jean-Michel Patrick Maurice Franchet et al. / SNECMA (Paris, FR)
A method for manufacturing an insert of elongate shape configured to be…

Braze Joining of Workpieces
US 08651362 B2, Feb. 18, 2014, Forming channel, groove, or aperture for reception of filler material, John Justin Mortimer / Radyne Corporation (Milwaukee, US)
A method of braze joining a first workpiece to a second workpiece, the method…

Joining Method of High Carbon Steel for Endless Hot Rolling and the Apparatus Therefor
US 08584923 B2, Nov. 19, 2013, Sheet material, Sang-Wook Ha et al. / POSCO (Pohang, KR)
A shear-joining method for endless hot rolling materials of high carbon steel…

Reflow Apparatus, a Reflow Method, and a Manufacturing Method of a Semiconductor Device
US 08490857 B2, July 23, 2013, Reducing gas, Hiroyuki Matsui et al. / Fujitsu Semiconductor Limited (Yokohama, JP)
A reflow method, comprising:…

Joint Apparatus, Joint Method, and Computer Storage Medium
US 08490856 B2, July 23, 2013, Component terminal to substrate surface, Osamu Hirakawa / Tokyo Electron Limited (Tokyo, JP)
A joint apparatus joining substrates having metal joint portions, comprising:…

Method for Producing Steel Pipe Plated With Metal by Thermal Spraying
US 08444042 B2, May 21, 2013, Elongated seam, Shinichiro Nakamura et al. / Daiwa Steel Tube Industries Co., Ltd. (Tokyo, JP)
A process for producing a metal tube comprising continuously forming a metal…

Brazing Method Using BCuP and BAg Braze Alloys
US 08448839 B1, May 28, 2013, With supplementary mechanical joining, Jeffrey Michael Breznak et al. / General Electric Company (Schenectady, US)
A brazing method comprising:…

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