Featured patents

Method of Reattaching an End Assembly to a Well Car
US 08820613 B2, Sept. 2, 2014, Attaching of bridge or tie member, William R. Halliar et al. / TTX Company (Chicago, US)
A method for reattaching a removed end assembly to a main body of a well…

Method for Manufacturing Substrate
US 08794499 B2, Aug. 5, 2014, Metal to nonmetal with separate metallic filler, Yasuyuki Sekimoto / Murata Manufacturing Co., Ltd. (Kyoto, JP)
A method for manufacturing a substrate, comprising the steps of:…

Solder Injection Head
US 08740040 B2, June 3, 2014, Including Means to Apply Flux or Filler to Work or Applicator, Yon Ho You et al. / Samsung Electro-Mechanics Co., Ltd. (Gyunggi-Do, KR)
A solder injection head comprising:…

Torsion Sonotrode, Ultrasonic Welding Device and Method for Producing a Welded Connection by Means of Ultrasonic Sound
US 08657182 B2, Feb. 25, 2014, Using high frequency vibratory energy, Albert Buettiker / Telsonic Holding AG (Bronschhofen, CH)
An ultrasonic welding device, comprising:…

Joining Method and Device Produced by This Method and Joining Unit
US 08651363 B2, Feb. 18, 2014, Component terminal to substrate surface, Tadatomo Suga et al. / Bondtech, Inc. (Kyoto, JP)
A bonding method for bonding objects to be bonded, each object having a bonding…

Method of Joining Graphite Fibers to a Substrate
US 08646677 B2, Feb. 11, 2014, With treating, Edmund P. Taddey et al. / Hamilton Sundstrand Space Systems International, Inc. (Windsor Locks, US)
A method of assembling a metallic-graphite structure comprising:…

Friction-Weld Interface for an Assembly
US 08631994 B2, Jan. 21, 2014, Including Means to Provide Heat by Friction Between Relatively Moving Surfaces, Shawn Michael Owen / GM Global Technology Operations LLC (Detroit, US)
A friction-weld interface device for improving a structural strength…

Welding System
US 08573470 B2, Nov. 5, 2013, With clamping or holding, Andrea Provesi et al. / Saipem S.p.A. (San Donato Milanese, Milan, IT)
A welding bug, comprising:…

Soldering Apparatus
US 08590765 B2, Nov. 26, 2013, Flowing flux or filler, Minoru Yamamoto et al. / Panasonic Corporation (Osaka, JP)
A soldering apparatus comprising:…

Injection Molded Solder Process for Forming Solder Bumps on Substrates
US 08496159 B2, July 30, 2013, Metal to nonmetal with separate metallic filler, Eric D. Perfecto et al. / International Business Machines Corporation (Armonk, US)
A method comprising:…

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