Featured patents

Coiled Tubing With Retainer for Conduit
US 08827140 B2, Sept. 9, 2014, And edge joining of one piece blank or strip, Mark Andreychuk
A method of providing coiled tubing from a strip of metal flat plate comprising…

Wire Bonding Tool
US 08820609 B2, Sept. 2, 2014, Wire lead bonder, Todd J. Walker / Orthodyne Electronics Corporation (Irvine, US)
A wire bonding tool comprising a body portion terminating in a tip portion,…

Induction Bonding
US 08701966 B2, April 22, 2014, Work portion comprises electrical component, Michael Nikkhoo et al. / Apple Inc. (Cupertino, US)
An apparatus for positioning a plurality of stranded wires on a printed circuit…

Welder Track Ring Clamp
US 08714433 B1, May 6, 2014, Process, Jamil C. Snead et al. / Lincoln Global, Inc. (Industry, US)
An assembly for welding comprising:…

Method and Soldering System of Soldering a DIP Component on a Circuit Board
US 08690041 B2, April 8, 2014, Plural joints, Hao-Chun Hsieh et al. / Wistron Corporation (Hsichih, New Taipei, TW)
A method of soldering a direct insertion process (DIP) component on a circuit…

Method of Manufacturing an Elongate Insert Made of a Metal Matrix Composite
US 08684255 B2, April 1, 2014, Bonding nonmetals with metallic filler, Jean-Michel Patrick Maurice Franchet et al. / SNECMA (Paris, FR)
A method for manufacturing an insert of elongate shape configured to be…

Hotbar Device and Methods for Assembling Electrical Contacts to Ensure Co-Planarity
US 08561879 B2, Oct. 22, 2013, Of electrical device, Mathias W. Schmidt et al. / Apple Inc. (Cupertino, US)
A method for assembling electrical contacts in an enclosure of a connector plug,…

Bonding Method, Bonding Apparatus, and Manufacturing Method of Semiconductor Device Using the Same
US 08540135 B2, Sept. 24, 2013, Wire bonding, Hiroaki Yoshino et al. / Shinkawa Ltd. (Tokyo, JP)
A bonding apparatus for performing bonding operation to a pad disposed on a free…

Methods for Stud Bump Formation and Apparatus for Performing the Same
US 08540136 B1, Sept. 24, 2013, Wire bonding, Hsin-Hung Liao et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method comprising:…

Wire Handling Facilitator
US 08517246 B1, Aug. 27, 2013, Solid flux or solid filler, Thomas W. Burns / AltoTec Wire Corporation (Traverse City, US)
A portable wire handling facilitator, comprising:…

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