Featured patents

Superplastically Formed Ultrasonically Welded Metallic Structure
US 08844796 B1, Sept. 30, 2014, Using dynamic frictional energy, Kevin T. Slattery / The Boeing Company (Chicago, US)
A method of making a structure by ultrasonic welding and superplastic forming,…

Methods of Joining Metallic Protective Layers
US 08777090 B2, July 15, 2014, Forming channel, groove, or aperture for reception of filler material, Leonid N. Shekhter et al. / H.C. Starck Inc. (Newton, US)
A method of joining metallic structures, the method comprising:…

Apparatus for Adhering Solder Powder and Method for Adhering Solder Powder to Electronic Circuit Board
US 08752754 B2, June 17, 2014, Metal to nonmetal with separate metallic filler, Takekazu Sakai et al. / Showa Denko K.K. (Tokyo, JP)
A method for adhering solder powder to an adhesive portion of an electronic…

Remote-Controlled Joining System
US 08708216 B2, April 29, 2014, Pipe joint aligner, Neil Woodward et al. / Statoil Petroleum AS (Stavanger, NO)
A system for remotely controlled subsea joining of an end of a first pipeline…

Hot Zone Igniter
US 08678270 B2, March 25, 2014, With treating, Gail E. Geiger et al. / Delphi Technologies, Inc. (Troy, US)
A method for brazing a metal leadframe clip to an electrical resistance heating…

System and Method for Integrally Forming a Stiffener With a Fiber Metal Laminate
US 08678267 B2, March 25, 2014, Using dynamic frictional energy, Loren J. Strahm et al. / The Boeing Company (Chicago, US)
A method of forming a unitized assembly, comprising the steps of:…

Expandable Mandrel for Use in Friction Stir Welding
US 08550326 B2, Oct. 8, 2013, Seam Backup Means, Paul T. Higgins et al. / MegaStir Technologies LLC (Provo, US)
A mandrel for use in friction stir welding of a pipe, said mandrel comprising…

Golf Club
US 08561876 B2, Oct. 22, 2013, Process, Akio Yamamoto / SRI Sports Limited (Kobe, JP)
A method for manufacturing a golf club head used for a golf club…

Solder Paste Transfer Process
US 08534533 B2, Sept. 17, 2013, Applied in powdered or particulate form, William D. Beair et al. / Raytheon Company (Waltham, US)
A solder paste transfer process, comprising:…

Soldering Structure and Method Using Zn
US 08517249 B2, Aug. 27, 2013, Adherent solid layer or coating, Young-ho Kim et al. / Samsung Electronics Co., Ltd. (Suwon-si, KR)
A soldering structure comprising:…

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