Featured patents

Compound Sealing Method for Vacuum Glass
US 08840007 B2, Sept. 23, 2014, Bonding nonmetals with metallic filler, Yanbing Li / Luoyang Landglass Technology Co., Ltd (Henan, CN)
A compound sealing method for vacuum glass, realizing the air-tight joint between…

Using Friction Stir Processing to Form Foamed Metal Precursors
US 08820610 B2, Sept. 2, 2014, Using dynamic frictional energy, Yoshihiko Hangai et al. / National University Corporation Gunma University (Maebashi-shi, JP)
A method for producing a functionally gradient material precursor comprising…

Method for Quality Control During Ultrasonic
US 08783545 B2, July 22, 2014, With condition responsive, program, or timing control, Michael Broekelmann et al. / Hesse GmbH (Paderborn, DE)
A method for quality control during ultrasonic bonding by assessing the quality…

Head Gimbal Assembly Carrier With Adjustable Protective Bar
US 08770463 B1, July 8, 2014, Work portion comprises electrical component, Wachira Puttichaem et al. / Western Digital Technologies, Inc. (Irvine, US)
A head gimbal assembly (HGA) carrier, comprising:…

Ultrasonic Bonding Systems and Methods of Using the Same
US 08746537 B2, June 10, 2014, Using high frequency vibratory energy, Orlando L. Valentin et al. / Orthodyne Electronics Corporation (Irvine, US)
An ultrasonic bonding system comprising:…

Manufacturing Method for Microvalves
US 08740045 B2, June 3, 2014, By cutting, Birgit Stadelbauer et al. / Buerkert Werke GmbH (Ingelfingen, DE)
A method for manufacturing of microvalves, each microvalve being composed…

Soldering System of Soldering a Dip Component on a Circuit Board
US 08740046 B2, June 3, 2014, Plural joints, Hao-Chun Hsieh et al. / Wistron Corporation (Hsichih, New Taipei, TW)
A soldering system for direct insertion process, comprising:…

Method for Bonding a Tantalum Structure to a Cobalt-Alloy Substrate
US 08608049 B2, Dec. 17, 2013, Using intermediate diffusion facilitating material, Gregory M. Hippensteel et al. / Zimmer, Inc. (Warsaw, US)
A method for bonding a porous tantalum structure to a substrate, comprising:…

Thermal Compress Bonding
US 08556158 B2, Oct. 15, 2013, Lead-less (or "bumped") device, Bor-Ping Jang et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method comprising:…

Method and Apparatus for Fabricating Vertical Deposition Mask
US 08459526 B2, June 11, 2013, With means to mask or stop work, Si-Young Park et al. / Samsung Display Co., Ltd. (Yongin-si, KR)
An apparatus for fabricating a vertical deposition mask, comprising:…

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