Featured patents

Method for Manufacturing a Steel Component, a Weld Seam, a Welded Steel Component, and a Bearing Component
US 08820615 B2, Sept. 2, 2014, Cooling under particular conditions, John Van De Sanden et al. / Aktiebolaget SKF (Gothenburg, SE)
A method for manufacturing a steel component comprising the steps of:…

Method and Tool for Friction Stir Welding
US 08857696 B1, Oct. 14, 2014, Including Means to Provide Heat by Friction Between Relatively Moving Surfaces, Fadi A. A. Al-Badour et al. / King Fahd University of Petroleum and Minerals (Dhahran, SA)
A tool for friction stir welding, comprising:…

Methods of Hardbanding Joints of Pipe Using Friction Stir Welding
US 08763881 B2, July 1, 2014, Using dynamic frictional energy, Shelton W. Alsup et al. / Smith International, Inc. (Houston, US)
A method for applying a wear reducing material to a tubular member used…

Semiconductor Device Support for Bonding
US 08720767 B2, May 13, 2014, Wire lead bonder, Jonathan Byars et al. / Orthodyne Electronics Corporation (Irvine, US)
A device for supporting a semiconductor device on a wire bonding machine,…

Ultrasonic Welding Machine and Method of Assembling the Ultrasonic Welding Machine
US 08695867 B2, April 15, 2014, Means to Apply Vibratory Solid-State Bonding Energy to Work, Alex Khakhalev / LG Chem, Ltd. (Seoul, KR)
An ultrasonic welding machine, comprising:…

Method and System for Retreading Track Wheel
US 08662376 B2, March 4, 2014, Repairing, restoring, or renewing product for reuse, Craig Mercier
A method for resurfacing a worn railway wheel substantially to an original…

Single Geometry Palletized Framing System
US 08651358 B2, Feb. 18, 2014, With Means to Handle Work or Product, Velibor Kilibarda / Comau, Inc. (Southfield, US)
A method of precisely locating a body assembly in a longitudinal (X), lateral (Y)…

Soldering Apparatus
US 08590765 B2, Nov. 26, 2013, Flowing flux or filler, Minoru Yamamoto et al. / Panasonic Corporation (Osaka, JP)
A soldering apparatus comprising:…

Method of Manufacturing Electronic Apparatus, Electronic Component-Mounting Board, and Method of Manufacturing the Same
US 08556157 B2, Oct. 15, 2013, Lead-less (or "bumped") device, Seiki Sakuyama et al. / Fujitsu Limited (Kawasaki, JP)
A method of manufacturing an electronic apparatus including a first component…

Thermal Conduction Device and Method for Fabricating the Same
US 08453916 B2, June 4, 2013, Bonding nonmetals with metallic filler, Chien-Min Sung et al. / Ritedia Corporation (Hsinchu, TW)
A method for fabricating a thermal conduction device, comprising:…

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