Featured patents

Ion Radiation Damage Prediction Method, Ion Radiation Damage Simulator, Ion Radiation Apparatus and Ion Radiation Method
US 08845913 B2, Sept. 30, 2014, With measuring, testing, or inspecting, Shoji Kobayashi et al. / Sony Corporation (Tokyo, JP)
A method of predicting damage of ion radiation to a fabrication object…

Method for Defect Reduction in Magnetic Write Head Fabrication
US 08828248 B2, Sept. 9, 2014, Forming or Treating Article Containing Magnetically Responsive Material, Xiaoye Zhao et al. / HGST Netherlands B.V (Amsterdam, NL)
A method of making a write pole for a perpendicular magnetic recording write…

Processes for Producing Substrate With Piercing Aperture, Substrate for Liquid Ejection Head and Liquid Ejection Head
US 08865009 B2, Oct. 21, 2014, Forming or Treating Thermal Ink Jet Article, Toshiyasu Sakai / Canon Kabushiki Kaisha (Tokyo, JP)
A process for producing a substrate with a piercing aperture, the piercing…

Scanned Source Oriented Nanofiber Formation
US 08858815 B2, Oct. 14, 2014, Masking of a Substrate Using Material Resistant to an Etchant, Jun Kameoka et al. / Cornell Research Foundation, Inc. (Ithaca, US)
A method comprising:…

Etchant for Controlled Etching of Ge and Ge-Rich Silicon Germanium Alloys
US 08753528 B2, June 17, 2014, Substrate contains silicon or silicon compound, Nicolas Daval et al. / International Business Machines Corporation (Armonk, US)
A method of etching a Ge-rich SiGe alloy in a controlled manner, said method…

Low Temperature Metal Etching and Patterning
US 08679359 B2, March 25, 2014, Using plasma, Fangyu Wu et al. / Georgia Tech Research Corporation (Atlanta, US)
A method of etching a metal layer disposed on a substrate in a reaction…

Method of Manufacturing Plastic Metallized Three-Dimensional Circuit
US 08663485 B2, March 4, 2014, Forming or Treating Electrical Conductor Article, Chuan Ling Hu et al. / (New Taipei, TW)
A method of manufacturing a plastic metallized three-dimensional (3D) circuit,…

Etching Composition
US 08647523 B2, Feb. 11, 2014, Nongaseous Phase Etching of Substrate, Tomonori Takahashi et al. / Fujifilm Electronic Materials U.S.A., Inc. (North Kingstown, US)
An etching composition, comprising:…

Fabricate Self-Formed Nanometer Pore Array at Wafer Scale for DNA Sequencing
US 08652340 B2, Feb. 18, 2014, Etching to Produce Porous or Perforated Article, Deqiang Wang et al. / International Business Machines Corporation (Armonk, US)
A method for configuring a structure, comprising:…

Patterned Lift-Off of Thin Films Deposited at High Temperatures
US 08652339 B1, Feb. 18, 2014, Masking of a Substrate Using Material Resistant to an Etchant, Neil P. Green et al. / The United States of America, as represented by the Secretary of the Navy (Washington, US)
A method for fabricating a patterned thin film on a substrate, comprising:…

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