Featured patents

Porous Nanostructures and Methods Involving the Same
US 08852447 B2, Oct. 7, 2014, Etching of Semiconductor Material to Produce an Article Having a Nonelectrical Function, Boyce E. Collins et al. / The Regents of the University of California (Oakland, US)
A method for forming a porous silicon matrix with a lateral pore gradient…

Polishing Apparatus and Exception Handling Method Thereof
US 08858817 B2, Oct. 14, 2014, By electrical means or of an electrical property, Mingqi Li et al. / Semiconductor Manufacturing International (Beijing) Corporation (Beijing, CN
An exception handling method, comprising:…

Method for Manufacturing a Magnetoresistive Sensor Using Simultaneously Formed Hard Bias and Electrical Lapping Guide
US 08778198 B2, July 15, 2014, Forming or Treating Article Containing Magnetically Responsive Material, Quang Le et al. / HGST Netherlands B.V. (Amsterdam, NL)
A method for manufacturing a magnetic sensor, comprising:…

Plasma Treatment Device and Plasma Treatment Method
US 08771537 B2, July 8, 2014, Using plasma, Toshihisa Ozu et al. / Tokyo Electron Limited JP
A plasma processing method which processes a substrate by generating plasma…

Remotely-Excited Fluorine and Water Vapor Etch
US 08771539 B2, July 8, 2014, Etching silicon containing substrate, Nitin K. Ingle et al. / Applied Materials, Inc. (Santa Clara, US)
A method of etching a patterned substrate in a substrate processing region…

Plasma Etching Method
US 08741166 B2, June 3, 2014, Etching a multiple layered substrate where the etching condition used produces a different etching rate or characteristic between at least two of the layers of the substrate, Mamoru Yakushiji et al. / Hitachi High-Technologies Corporation (Tokyo, JP)
A plasma etching method for selectively etching a silicon nitride film against…

Method of Forming a Patterned Substrate
US 08652345 B2, Feb. 18, 2014, Substrate contains elemental metal, alloy thereof, or metal compound, Matthew H. Frey et al. / 3M Innovative Properties Company (St. Paul, US)
A method of forming a patterned substrate comprising:…

Fabricate Self-Formed Nanometer Pore Array at Wafer Scale for DNA Sequencing
US 08652340 B2, Feb. 18, 2014, Etching to Produce Porous or Perforated Article, Deqiang Wang et al. / International Business Machines Corporation (Armonk, US)
A method for configuring a structure, comprising:…

Plasma Etching Apparatus, Plasma Etching Method and Storage Medium
US 08641916 B2, Feb. 4, 2014, Using plasma, Shin Okamoto et al. / Tokyo Electron Limited (Tokyo, JP)
A plasma etching method for forming a hole in an etching target film by using…

Plasma Processing Method
US 08591752 B2, Nov. 26, 2013, Forming or Treating Article Containing Magnetically Responsive Material, Takahiro Abe et al. / Hitachi High Technologies Corporation (Tokyo, JP)
A plasma processing method for plasma-etching a to-be-processed substrate having…

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