Featured patents

Method for Fabricating Carbon Nanotube Film
US 08828256 B2, Sept. 9, 2014, Using plasma, Kai Liu et al. / Tsinghua University (Beijing, CN)
A method for fabricating a carbon nanotube film, the method comprising the steps…

Etch Rate Detection for Reflective Multi-Material Layers Etching
US 08808559 B2, Aug. 19, 2014, By optical means or of an optical property, Michael Grimbergen / Applied Materials, Inc. (Santa Clara, US)
A method of determining an etching endpoint of a reflective multi-material layer…

Through-Hole Forming Method and Inkjet Head
US 08771528 B2, July 8, 2014, Forming or treating of groove or through hole, Keiichi Sasaki et al. / Canon Kabushiki Kaisha (Tokyo, JP)
A through-hole forming method comprising steps of:…

Method of Manufacturing Inkjet Head and the Inkjet Head
US 08721904 B2, May 13, 2014, Forming or Treating Thermal Ink Jet Article, Shinji Kobari / Toshiba Tec Kabushiki Kaisha (Tokyo, JP)
A method of manufacturing an inkjet head comprising:…

Method and Apparatus for Structuring Components Made of a Material Composed of Silicon Oxide
US 08652341 B2, Feb. 18, 2014, Using plasma, Thomas Gessner et al. / FHR Anlagenbau GmbH (Ottendorf-Okrilla, DE)
A method for structuring a component made of a material selected from the group…

Thin Film Support Substrate for Use in Hydrogen Production Filter and Production Method of Hydrogen Production Filter
US 08562847 B2, Oct. 22, 2013, Etching to Produce Porous or Perforated Article, Yoshinori Oota et al. / Dai Nippon Insatsu Kabushiki Kaisha (Tokyo, JP)
A production method of a hydrogen production filter using a thin film support…

Forming Nanometer-Sized Patterns by Electron Microscopy
US 08568605 B2, Oct. 29, 2013, Using ion beam, ultraviolet, or visible light, Andrew P. Homyk et al. / California Institute of Technology (Pasadena, US)
A method for forming a nanometer-sized pattern in a membrane, the method…

Printed Circuit Board Manufacturing System and Manufacturing Method Thereof
US 08535547 B2, Sept. 17, 2013, Forming or treating of groove or through hole, Seok-Hwan Ahn et al. / Samsung Electro-Mechanics Co., Ltd. (Suwon, KR)
A method of manufacturing a printed circuit board, comprising:…

Critical Dimension Control During Template Formation
US 08545709 B2, Oct. 1, 2013, Masking of a Substrate Using Material Resistant to an Etchant, Frank Y. Xu et al. / Molecular Imprints, Inc. (Austin, US)
A nanoimprint lithography method for controlling critical dimension variations…

Composition for Wet Etching of Silicon Dioxide
US 08465662 B2, June 18, 2013, Substrate contains silicon or silicon compound, Seong Hwan Park et al. / Techno Semichem Co., Ltd. (Seongnam-si, KR)
A composition for wet etching of silicon dioxide, comprising:…

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