Featured patents

Ion Radiation Damage Prediction Method, Ion Radiation Damage Simulator, Ion Radiation Apparatus and Ion Radiation Method
US 08845913 B2, Sept. 30, 2014, With measuring, testing, or inspecting, Shoji Kobayashi et al. / Sony Corporation (Tokyo, JP)
A method of predicting damage of ion radiation to a fabrication object…

Liquid Processing Method, Recording Medium Having Recorded Program for Executing Liquid Processing Method Therein and Liquid Processing Apparatus
US 08815112 B2, Aug. 26, 2014, Substrate contains elemental metal, alloy thereof, or metal compound, Hiromitsu Namba et al. / Tokyo Electron Limited (Tokyo, JP)
A method for processing a substrate comprising:…

Methods for Automatically Determining Capacitor Values and Systems Thereof
US 08828259 B2, Sept. 9, 2014, By electrical means or of an electrical property, Arthur H. Sato / Lam Research Corporation (Fremont, US)
A method for automatically performing power matching using a mechanical RF match…

Fabricating Method of Flexible Circuit Board
US 08828245 B2, Sept. 9, 2014, Forming or Treating Electrical Conductor Article, Yu-Chung Chen et al. / Industrial Technology Research Institute (Hsinchu, TW)
A fabrication method of a flexible circuit board, the fabrication method…

Method for Chemical Mechanical Polishing Tungsten
US 08865013 B2, Oct. 21, 2014, Using film of etchant between a stationary surface and a moving surface, Jerry Lee et al. / Rohm and Haas Electronic Materials CMP Holdings, Inc. (Newark, US)
A method for chemical mechanical polishing of a substrate, comprising:…

Method for Producing a Semiconductor Component and a Semiconductor Component Produced According to the Method
US RE044995 E1, July 8, 2014, Etching of Semiconductor Material to Produce an Article Having a Nonelectrical Function, Hans Artmann et al. / Robert Bosch GmbH (Stuttgart, DE)
A method for producing a semiconductor component, comprising:…

Methods for Optimizing a Plasma Process
US 08741164 B2, June 3, 2014, By optical means or of an optical property, Sangwuk Park et al. / Samsung Electronics Co., Ltd. KR
A method for controlling a plasma process, comprising:…

Substrate Processing Method and Storage Medium
US 08715520 B2, May 6, 2014, Substrate contains elemental metal, alloy thereof, or metal compound, Eiichi Nishimura et al. / Tokyo Electron Limited (Tokyo, JP)
A substrate processing method for etching a layer, containing, at least,…

Critical Dimension Control During Template Formation
US 08545709 B2, Oct. 1, 2013, Masking of a Substrate Using Material Resistant to an Etchant, Frank Y. Xu et al. / Molecular Imprints, Inc. (Austin, US)
A nanoimprint lithography method for controlling critical dimension variations…

Polymer Layer Removal on Pzt Arrays Using a Plasma Etch
US 08465659 B2, June 18, 2013, Forming or Treating Thermal Ink Jet Article, Mark A. Cellura et al. / Xerox Corporation (Norwalk, US)
A method for forming an ink jet print head, comprising:…

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