Featured patents

Structure and Method to Fabricate Tooling for Bumping Thin Flex Circuits
US 08845907 B2, Sept. 30, 2014, Forming or Treating an Article Whose Final Configuration Has a Projection, Peter J. Nystrom et al. / Xerox Corporation (Norwalk, US)
A method for forming a post plate for embossing a printhead flexible printed…

Method for Fabricating Carbon Nanotube Film
US 08828256 B2, Sept. 9, 2014, Using plasma, Kai Liu et al. / Tsinghua University (Beijing, CN)
A method for fabricating a carbon nanotube film, the method comprising the steps…

Substrate Processing Method
US 08828260 B2, Sept. 9, 2014, Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to ethching to change properties of substrate toward the etchant, Hideki Shimoi et al. / Hamamatsu Photonics K.K. (Hamamatsu-shi, Shizuoka, JP)
A substrate processing method for forming a space extending along a predetermined…

Process for Making Microneedles, Microneedle Arrays, Masters, and Replication Tools
US 08858807 B2, Oct. 14, 2014, Forming or Treating an Article Whose Final Configuration Has a Projection, Mitchell A. F. Johnson et al. / 3M Innovative Properties Company (St. Paul, US)
A process for preparing microneedles comprising…

Method and Apparatus for Plasma Surface Treatment of a Moving Substrate
US 08702999 B2, April 22, 2014, Masking of a Substrate Using Material Resistant to an Etchant, Eugen Aldea et al. / FujiFilm Manufacturing Europe B.V. (Tilburg, NL)
A method for treatment of a substrate surface, comprising:…

Semiconductor Fabrication Apparatuses to Perform Semiconductor Etching and Deposition Processes and Methods of Forming Semiconductor Device Using the Same
US 08652342 B2, Feb. 18, 2014, Using plasma, Sang-Jun Park et al. / Samsung Electronics Co., Ltd (Suwon-si, KR)
A method of fabricating a semiconductor device using a semiconductor fabrication…

Methods and Apparatus for Atomic Layer Etching
US 08617411 B2, Dec. 31, 2013, Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to etching to change properties of substrate toward the etchant, Harmeet Singh / Lam Research Corporation (Fremont, US)
A method for etching a layer on a substrate in a semiconductor processing…

Brittle Non-Metallic Workpiece With Through Hole and Method for Making Same
US 08518280 B2, Aug. 27, 2013, Treating glass, Vladimir Stepanovich Kondratenko et al. / Hon Hai Precision Industry Co., Ltd. (New Taipei, TW)
A method for making a through hole in a brittle non-metallic workpiece,…

Substrate Processing Method
US 08449785 B2, May 28, 2013, Masking of a Substrate Using Material Resistant to an Etchant, Takashi Kondo / Tokyo Electron Limited (Tokyo, JP)
A substrate processing method for processing a substrate mounted on a mounting…

Microneedle Structure and Production Method Therefor
US 08454844 B2, June 4, 2013, Forming or Treating an Article Whose Final Configuration Has a Projection, Erwin J W Berenschot et al. / NanoPass Technologies Ltd. (Nes Ziona, IL)
A method for forming a microneedle structure from a wafer, the microneedle…

Patentorg has 629 documents under Etching a Substrate: Processes Patents.

Narrow down the browsing criteria below to see more patents.

Select a subcategory
Quick navigation
New documents
  • Process for the Production of the Actinobacillus Pleuropneumoniae Toxins APXI or APXIII in a Liquid Culture Medium Under Supply of Air Enriched in Carbon Dioxide
  • Method for Manufacturing Nonvolatile Memory Device
  • Supply Chain Demand Satisfaction
  • Supply-Line Management Device
  • Storage Control Device and Method for Managing Snapshot