Featured patents

Method for Chemical Mechanical Planarization of a Tungsten-Containing Substrate
US 08858819 B2, Oct. 14, 2014, Using film of etchant between a stationary surface and a moving surface, Rachel Dianne McConnell et al. / Air Products and Chemicals, Inc. (Allentown, US)
A method of chemical mechanical polishing of a substrate comprising tungsten,…

Patterning Process
US 08858813 B2, Oct. 14, 2014, Etching and Coating Occur in the Same Processing Chamber, Matthew H. Frey et al. / 3M Innovative Properties Company (St. Paul, US)
A process comprising (a) providing at least one substrate having at least one…

Manufacturing Method for Ink Jet Recording Head Chip, and Manfuacturing Method for Ink Jet Recording Head
US RE044945 E1, June 17, 2014, Etching of Semiconductor Material to Produce an Article Having a Nonelectrical Function, Toshiyasu Sakai et al. / Canon Kabushiki Kaisha (Tokyo, JP)
A manufacturing method for a substrate for an ink jet head including an energy…

Method and System for Defining a Read Sensor Using an Ion Mill Planarization
US 08597528 B1, Dec. 3, 2013, Forming or Treating Article Containing Magnetically Responsive Material, Anup G. Roy et al. / Western Digital (Fremont), LLC (Fremont, US
A method for fabricating a magnetic transducer having a magnetoresistive stack,…

Method of Manufacturing RFID Based Thermal Bubble Type Accelerometer
US 08580127 B2, Nov. 12, 2013, Etching of Semiconductor Material to Produce an Article Having a Nonelectrical Function, Jium Ming Lin / Chung Hua University (Hsinchu, TW)
A method of manufacturing an RFID based thermal bubble type accelerometer,…

Multilayer Wiring Board and Manufacturing Method Thereof
US 08591750 B2, Nov. 26, 2013, Forming or Treating Electrical Conductor Article, Kenichi Kawabata et al. / TDK Corporation (Tokyo, JP)
A method for manufacturing a multilayer wiring board, comprising the steps of:…

Method of Controlling Etch Microloading for a Tungsten-Containing Layer
US 08518282 B2, Aug. 27, 2013, Etching and Coating Occur in the Same Processing Chamber, Bryan Pu et al. / Lam Research Corporation (Fremont, US)
A method of etching a tungsten containing layer through a mask with wide…

Method of Hydrophobizing and Patterning Frontside Surface of Integrated Circuit
US 08491803 B2, July 23, 2013, Forming or Treating Thermal Ink Jet Article, Emma Rose Kerr et al. / Zamtec Ltd (Dublin, IE)
A method of hydrophobizing a nozzle plate of a printhead integrated circuit, said…

Substrate Liquid Processing Apparatus, Substrate Liquid Processing Method, and Storage Medium Having Substrate Liquid Processing Program Stored Therein
US 08475668 B2, July 2, 2013, Forming or Treating Electrical Conductor Article, Hiroshi Tanaka et al. / Tokyo Electron Limited (Tokyo, JP)
A substrate liquid processing method comprising:…

Selective Etch Back Process for Carbon Nanotubes Intergration
US 08449781 B2, May 28, 2013, Forming or Treating Fibrous Article or Fiber Reinforced Composite Structure, Ryan M. Martin et al. / International Business Machines Corporation (Armonk, US)
A method for selectively etching-back a polymer matrix to expose tips of carbon…

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