Featured patents

Method of Differential Counter Electrode Tuning in an RF Plasma Reactor
US 08734664 B2, May 27, 2014, Specific configuration of electrodes to generate the plasma, Kartik Ramaswamy et al. / Applied Materials, Inc. (Santa Clara, US)
In a plasma reactor chamber, a method of controlling distribution of a plasma…

Techniques Providing Photoresist Removal
US 08734662 B2, May 27, 2014, Gas Phase and Nongaseous Phase Etching on the Same Substrate, Kuo Bin Huang et al. / Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW)
A method for manufacturing a semiconductor device, the method comprising:…

Bevel Etcher With Vacuum Chuck
US 08721908 B2, May 13, 2014, Using plasma, Gregory Sexton et al. / Lam Research Corporation (Fremont, US)
A method of reducing curvature of a bowed semiconductor substrate during bevel…

Plasma Reactor With Adjustable Plasma Electrodes and Associated Methods
US 08715519 B2, May 6, 2014, With measuring, testing, or inspecting, Daniel Harrington / Micron Technology, Inc. (Boise, US)
A method for operating a plasma reactor, comprising:…

Method for Producing Silicon Fine Particles and Method for Controlling Particle Diameter of Silicon Fine Particles
US 08673168 B2, March 18, 2014, Etching using radiation, Shingo Ono et al. / Bridgestone Corporation (Tokyo, JP)
A method for producing silicon fine particles having a smaller particle diameter…

Method for Manufacturing a Printed Circuit Board and a Printed Circuit Board Obtained by the Manufacturing Method
US 08663484 B2, March 4, 2014, Forming or Treating Electrical Conductor Article, Yoshiyuki Asakawa et al. / Sumitomo Metal Mining Co., Ltd. JP
A method for manufacturing a printed circuit board, comprising: forming a base…

Group III-nitride Layers With Patterned Surfaces
US 08613860 B2, Dec. 24, 2013, Forming or Treating an Article Whose Final Configuration Has a Projection, Richart Elliott Slusher et al. / Alcatel Lucent (Paris, FR)
A method of fabricating a structure, comprising:…

Method of Making a Mask, Method of Patterning by Using This Mask and Method of Manufacturing a Micro-Device
US 08529777 B2, Sept. 10, 2013, Masking of a Substrate Using Material Resistant to an Etchant, Hisayoshi Watanabe et al. / TDK Corporation (Tokyo, JP)
A method of making a mask for patterning a thin film, comprising:…

Polishing Composition and Polishing Method
US 08501027 B2, Aug. 6, 2013, Etchant contains solid particle, Chiyo Horikawa et al. / Fujimi Incorporated (Nishikasugai-gun, Aichi, JP)
A method comprising:…

System, Method and Apparatus for Fabricating a C-Aperture or E-Antenna Plasmonic Near Field Source for Thermal Assisted Recording Applications
US 08486289 B2, July 16, 2013, Gas Phase and Nongaseous Phase Etching on the Same Substrate, Jordan Asher Katine et al. / HGST Netherlands B.V. (Amsterdam, NL)
A method of fabricating a plasmonic near field source for thermal assisted…

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