Featured patents

Stress Adjustment in Reactive Sputtering
US 08808513 B2, Aug. 19, 2014, Specified power supply or matching network, Valery Felmetsger et al. / OEM Group, Inc (Gilbert, US)
A stress adjustment unit comprising—…

Vanadium Oxide Thin Films
US 08864957 B2, Oct. 21, 2014, Specified deposition material or use, Venkatesh Narayanamurti et al. / President and Fellows of Harvard College (Cambridge, US)
A method comprising:…

High-Voltage Microfluidic Droplets Actuation by Low-Voltage Fabrication Technologies
US 08764958 B2, July 1, 2014, Electrophoretic or electro-osmotic apparatus, Gary Chorng-Jyh Wang
A device for high-voltage droplet actuation comprising:…

Gas Sensor Control System Ensuring Increased Measurement Accuracy
US 08721856 B2, May 13, 2014, Gas sample sensor, Takayuki Ishikawa et al. / Denso Corporation (Kariya, JP)
A gas sensor control system for controlling an operation of a gas sensor equipped…

Gas Sensor Element and Method of Detecting Concentration of Target Detection Gas
US 08715474 B2, May 6, 2014, Gas sample sensor, Takehiro Watarai et al. / Denso Corporation (Kariya, JP)
A gas sensor element comprising: a solid electrolyte layer having proton…

Method and Apparatus for the Separation and Quantification of Particles
US 08685217 B2, April 1, 2014, Dielectrophoresis, Nicolò Manaresi et al. / Silicon Biosystems S.p.A. (Bologna, IT)
A method for the separation of a sample of particles comprising at least first…

Methods and Apparatus for Sputtering
US 08585873 B2, Nov. 19, 2013, Measuring or testing, Rajkumar Jakkaraju et al. / Aviza Technology Limited (Newport, Gwent, GB)
A method of sputtering comprising:…

Ionic Probe
US 08551311 B2, Oct. 8, 2013, Measuring carbon or pH, Pierre Antoine Robert Livrozet et al. / Hach Company (Loveland, US)
An ionic probe, comprising:…

Electrochemical Ion Exchange Treatment of Fluids
US 08562803 B2, Oct. 22, 2013, And using ion exchange material, Ashok Kumar Janah et al. / Pionetics Corporation (San Carlos, US)
A fluid treatment apparatus comprising:…

Plating Apparatus and Plating Method
US 08486234 B2, July 16, 2013, With current, voltage, or power control means, Nobutoshi Saito et al. / Ebara Corporation (Tokyo, JP)
An apparatus for plating an object, comprising:…

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