Featured patents

Continuous Electrolytic Surface Finishing of Bars
US 08821699 B2, Sept. 2, 2014, Work conveyer, Ilaria Muratori et al. / Plating Innovation s.r.l. (Settimo Milanese, IT)
An apparatus for continuous electrolytic surface finishing of bars comprising…

Gas Sensor Element
US 08795492 B2, Aug. 5, 2014, Protective element is a layer, Makoto Ito et al. / Denso Corporation (Kariya, JP)
A gas sensor element comprising:…

Method for Manufacturing Perpendicular Magnetic Recording Medium
US 08795478 B2, Aug. 5, 2014, Ferromagnetic, Yoshinori Honda et al. / HGST Netherlands B.V. (Amsterdam, NL)
A method for manufacturing a perpendicular magnetic recording medium, comprising:…

Hot Tile Sputtering System
US 08673122 B2, March 18, 2014, Specified target particulars, Jeffrey D. Harlow et al. / Magna Mirrors of America, Inc. (Holland, US)
A sputtering assembly for sputtering a coating onto a glass substrate in a vacuum…

Sputtering System for Depositing Thin Film and Method for Depositing Thin Film
US 08663431 B2, March 4, 2014, Glow discharge sputter deposition, Shinichi Morohashi / Yamaguchi University (Yamaguchi, JP)
A method of sputtering comprising:…

Apparatus for Protein Separation Using Capillary Isoelectric Focusing—hollow Fiber Flow Field Flow Fractionation and Method Thereof
US 08585884 B2, Nov. 19, 2013, Isoelectric focusing, Myeong Hee Moon et al. / Industry-Academic Cooperation Foundation, Yonsei University KR
An apparatus for the separation of proteins, comprising:…

Flat End-Block for Carrying a Rotatable Sputtering Target
US 08562799 B2, Oct. 22, 2013, Specified target particulars, Wilmert De Bosscher et al. / Soleras Advanced Coatings BVBA (Deinze, BE)
An end-block for rotatably carrying a target around an axis of rotation…

Continuous Plating Apparatus
US 08518222 B2, Aug. 27, 2013, With current control, Tomohiro Noda et al.
A continuous plating apparatus capable of continuously plating workpieces…

Reference Electrode Coated With Ionic Liquid and Electrochemical Measurement System Using the Reference Electrode
US 08486246 B2, July 16, 2013, Standard reference electrode, Satoshi Nomura et al. / HORIBA, Ltd. (Kyoto-shi, JP)
A reference electrode comprising:…

Method of Fabricating Bubble-Type Micro-Pump
US 08500964 B2, Aug. 6, 2013, Specified deposition material or use, Chen Peng / Benq Materials Corp. (Taoyuan County, TW)
A method of fabricating a bubble-type micro-pump, comprising:…

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