Featured patents

Shielding and Potting for Electrical Circuits
US 08822844 B1, Sept. 2, 2014, Specific layers, Luke W. Horak et al. / Rockwell Collins, Inc. (Cedar Rapids, US)
A device, comprising:…

LAN Cable With Dual Layer PEI/FRPP Insulation for Primary Conductors
US 08829352 B2, Sept. 9, 2014, Flame, weather or mold proof, Thierry Auvray et al. / NEXANS (Paris, FR)
A plenum rated communications cable, said cable comprising:…

Electrical Wire Holding Device
US 08803006 B2, Aug. 12, 2014, Seal, Shinji Ito et al. / Hitachi Metals, Ltd. (Tokyo, JP)
An electrical wire holding device, comprising:…

Printed Wiring Board Fabrication Method, Printed Wiring Board, Multilayer Printed Wiring Board, and Semiconductor Package
US 08754337 B2, June 17, 2014, Feedthrough, Kenichi Kaneda / Sumitomo Bakelite Co., Ltd. (Tokyo, JP)
A method for fabricating a printed wiring board having a through-hole in a core…

Modular Enclosure Assembly for Terminals Wiring and Distribution
US 08680407 B1, March 25, 2014, Joining parts, James Chun-Nam Chan / VPL Enterprises Ltd. (Langley, BC, CA)
A modular enclosure assembly for terminals wiring and distribution incorporating,…

Longitudinal Shield Tape Wrap Applicator With Edge Folder to Enclose Drain Wire
US 08674228 B2, March 18, 2014, Plural, insulated, Moe J. Jaber et al. / General Cable Technologies Corporation (Highland Heights, US)
A shielded electrical cable, comprising a plurality of insulated conductors;…

Multilayer Portable Device Case and Method Therefor
US 08624111 B2, Jan. 7, 2014, Boxes and Housings, Fernando Tages et al. / A.G. Findings & Mfg. Co. (Fort Lauderdale, US)
A mobile device case, comprising:…

Waterproof Assembly and Device Employing the Same
US 08604362 B2, Dec. 10, 2013, Threaded casing with deformable member, Shih-Chang Hsu / Hon Hai Precision Industry Co., Ltd. (New Taipei, TW)
A waterproof assembly for a device comprising a shell, a cover mounted…

Multilayer Printed Wiring Board and Method of Manufacturing the Same
US 08575496 B2, Nov. 5, 2013, With electrical device, Hironori Tanaka / Ibiden Co., Ltd. (Ogaki-shi, JP)
A multilayer printed wiring board, comprising: a layered capacitor section having…

Electronic Component-Embedded Printed Circuit Board
US 08552305 B2, Oct. 8, 2013, With electrical device, Jin Seon Park et al. / Samsung Electro-Mechanics Co., Ltd. (Suwon, Gyunggi-do, KR)
An electronic component-embedded printed circuit board comprising:…

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