Featured patents

Sealing Structure
US 08835761 B2, Sept. 16, 2014, Hermetic sealed envelope type, Makoto Hora et al. / NOK Corporation JP
A sealing structure comprising:…

Printed Circuit Board and Method for Manufacturing the Same
US 08785789 B2, July 22, 2014, With particular conductive connection, Dae Young Lee et al. / Samsung Electro-Mechanics Co., Ltd. (Gyunggi-Do, KR)
A printed circuit board (PCB) comprising:…

Printed Wiring Board and Method for Manufacturing the Same
US 08866027 B2, Oct. 21, 2014, Voidless, Narito Yagi et al. / Sumitomo Electric Industries, Ltd. (Osaka, JP)
A printed wiring board that is a substrate for a suspension in a hard…

Crosslinkable Polymer Composition
US 08866016 B2, Oct. 21, 2014, Insulated, Claes Broman et al. / Borealis AG (Vienna, AT)
A polymer composition comprising…

Cable Connector Systems and Methods Including Same
US 08716600 B2, May 6, 2014, With joints, Matthew Spalding et al. / Tyco Electronics Corporation (Berwyn, US)
A cable connection assembly comprising:…

US 08674231 B2, March 18, 2014, Preformed panel circuit arrangement, Masaki Takamatsu / Fujifilm Corporation (Tokyo, JP)
An endoscope comprising:…

Conductive Pattern and Manufacturing Method Thereof
US 08637776 B2, Jan. 28, 2014, Preformed panel circuit arrangement, Yong-Koo Son et al. / LG Chem, Ltd. (Seoul, KR)
A conductive pattern in which a line width is 0.1 micrometers to 100 micrometers…

EMC Protected Compression Unit and a Sealing System Comprising Such Compression Unit
US 08598472 B2, Dec. 3, 2013, With fastener, Ulf Hildingsson / Roxtec AB (Karlskrona, SE)
A compression unit for a modular sealing system, comprising:…

Wireless Telemetry Electronic Circuit Board for High Temperature Environments
US 08525036 B2, Sept. 3, 2013, Convertible shape or circuit, John R. Fraley et al. / Siemens Energy, Inc. (Orlando, US)
In a combustion turbine engine, a circuit assembly affixed to a turbine blade…

Wired Circuit Board Assembly Sheet
US 08487189 B2, July 16, 2013, Preformed panel circuit arrangement, Kouji Kataoka et al. / Nitto Denko Corporation (Osaka, JP)
A wired circuit board assembly sheet comprising:…

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