Featured patents

Circuit Board Including Mask for Controlling Flow of Solder
US 08853550 B2, Oct. 7, 2014, With particular substrate or support structure, Arun Virupaksha Gowda et al. / General Electric Company (Niskayuna, US)
A circuit board comprising:…

Method of Fabricating a Printed Circuit Board
US 08729406 B2, May 20, 2014, With solder, Young Gwan Ko / Samsung Electro-Mechanics Co., Ltd (Suwon, Gyunggi-Do, KR)
A method of fabricating a printed circuit board, comprising:…

Wiring Board Capable of Containing Functional Element and Method for Manufacturing Same
US 08692135 B2, April 8, 2014, Voidless, Daisuke Ohshima et al. / NEC Corporation (Tokyo, JP)
A wiring board, constituted by stacking at least one conductor wiring layer…

Electrical Box and Frame Assembly for Shallow Wall Cavities Formed by Furring Strips
US 08664542 B1, March 4, 2014, Wall Mounted, Thomas J. Gretz / Arlington Industries, Inc. (Scranton, US)
An electrical assembly comprising:…

Flex-Rigid Wiring Board and Method for Manufacturing the Same
US 08609991 B2, Dec. 17, 2013, Convertible shape or circuit, Michimasa Takahashi / Ibiden Co., Ltd. (Ogaki-shi, JP)
A flex-rigid wiring board comprising:…

Electrical Box for Installation in Insulated Concrete Form Construction
US 08575483 B2, Nov. 5, 2013, With box or housing mounting means, Sébastien Gauthier / Ipex Technologies Inc. (Mississauga, Ontario, CA)
An electrical box, comprising:…

Wiring Board, Wiring Board Manufacturing Method, and via Paste
US 08563872 B2, Oct. 22, 2013, Voidless, Yutaka Nakayama et al. / Panasonic Corporation (Osaka, JP)
A wiring board comprising an insulating resin layer, a plurality of wirings laid…

Ultra-Low Current Printed Circuit Board
US 08507802 B1, Aug. 13, 2013, With particular substrate or support structure, William Knauer / Keithley Instruments, Inc. (Cleveland, US)
A printed circuit board for minimizing dielectric losses experienced by…

Wiring Board for Semiconductor Devices, Semiconductor Device, Electronic Device, and Motherboard
US 08507805 B2, Aug. 13, 2013, With electrical device, Seiya Fujii / Elpida Memory, Inc. (Tokyo, JP)
A board comprising: a substrate including a first surface; a land provided…

Signal Transmission Line and Circuit Board
US 08450614 B2, May 28, 2013, Convertible shape or circuit, Jun Sasaki et al. / Murata Manufacturing Co., Ltd. (Kyoto, JP)
A signal transmission line comprising:…

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