Featured patents

Flexible Busbar
US 08859897 B2, Oct. 14, 2014, Bus bars or bus ducts (Residual), Jean Claude Fuchs et al. / ERICO International Corporation (Solon, US)
A flexible busbar comprising:…

Wiring Structure and Manufacturing Method Thereof, and Electronic Apparatus and Manufacturing Method Thereof
US 08872040 B2, Oct. 28, 2014, Insulating, Yoshihiro Nakata et al. / Fujitsu Limited (Kawasaki, JP)
A wiring structure, comprising:…

Display Device
US 08754332 B2, June 17, 2014, Convertible shape or circuit, Yukihiro Sumida et al. / Sharp Kabushiki Kaisha (Osaka, JP)
A display device, comprising:…

Printed Wiring Board Fabrication Method, Printed Wiring Board, Multilayer Printed Wiring Board, and Semiconductor Package
US 08754337 B2, June 17, 2014, Feedthrough, Kenichi Kaneda / Sumitomo Bakelite Co., Ltd. (Tokyo, JP)
A method for fabricating a printed wiring board having a through-hole in a core…

Shielding Apparatus and Cabinet With Same
US 08735742 B2, May 27, 2014, Flexible, Tsung-Yuan Chen / Hon Hai Precision Industry Co., Ltd. (New Taipei, TW)
An electromagnetic interference (EMI) shielding apparatus, comprising:…

Printed Board Assembly Interface Structures
US 08748750 B2, June 10, 2014, With cooling means, Michael J. Gillespie et al. / Honeywell International Inc. (Morristown, US)
An assembly comprising:…

Electrical Wire Splice Sealing Assembly and Method
US 08653368 B2, Feb. 18, 2014, Sleeve and end cap-type casing, Gregory A. Genco et al. / Carlisle Interconnect Technologies, Inc. (Saint Augustine, US)
An apparatus, comprising:…

Electromagnetically Shielded Enclosure and Entry Seal
US 08530756 B1, Sept. 10, 2013, Access panel or opening, Gary William Winch
An electromagnetically shielded enclosure comprising a metalized fabric providing…

Method for Removing a Part of a Planar Material Layer and Multilayer Structure
US 08541689 B2, Sept. 24, 2013, Insulating, Andreas Zluc et al. / AT & S Austria Technologie & Systemtecknik Aktiengesellschaft (Leoben-Hinterberg, AT)
A method for removing a subportion or part of a substantially flat or planar…

Multilayer Printed Board and Method for Manufacturing the Same
US 08476534 B2, July 2, 2013, With particular material, Akira Tachibana et al. / Furukawa Electric Co., Ltd. (Tokyo, JP)
A multilayer printed board comprising:…

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