Featured patents

Electrohydrodynamic Airflow Across a Heat Sink Using a Non-Planar Ion Emitter Array
US 08807204 B2, Aug. 19, 2014, Having heating and cooling capability, Mark E. Steinke et al. / International Business Machines Corporation (Armonk, US)
A system, comprising:…

Heat Exchanger With Side Plate Having a Through Hole
US 08800642 B2, Aug. 12, 2014, With edge cover or frame means, Hidetake Kuwahara et al. / Denso Corporation (Kariya, JP)
A heat exchanger comprising:…

Latent Heat Storage Device
US 08776865 B2, July 15, 2014, Heat collector, Gerd Gaiser / J. Eberspaecher GmbH & Co. KG (Esslingen, DE)
A latent heat storage device for an exhaust system of a combustion engine,…

Exhaust Gas Heat Exchanger With Integrated Mounting Interface
US 08776872 B2, July 15, 2014, Conduit coiled within casing, Oliver Fischer et al. / Halla Visteon Climate Control Corporation (Daejeon-si, KR)
A heat exchanger for an exhaust gas system of a motor vehicle comprising:…

Alternating Plate Headerless Heat Exchangers
US 08646516 B2, Feb. 11, 2014, Stacked plates or shells form interplate passages, Steven Lin et al. / Pana Canada Corporation (Oakville, Ontario, CA)
A heat exchanger selected from the group of vehicular heat exchangers consisting…

Tennis Ball Conditioner
US 08616270 B2, Dec. 31, 2013, Having heating and cooling capability, Ralph Samuel Granchelli, Jr.
A tennis ball conditioner for conditioning tennis balls, said tennis ball…

Heat Exchanger
US 08550151 B2, Oct. 8, 2013, With Coated, Roughened or Polished Surface, Takuya Murayama et al. / Panasonic Corporation (Osaka, JP)
A heat exchanger comprising:…

Shell-And-Tube Heat Exchanger With Helical Baffles
US 08540011 B2, Sept. 24, 2013, In common casing, Dongjie Zhang et al. / Xi'an Jiaotong University CN
A multiple shell pass shell-and-tube heat exchanger with helical baffles,…

Heat Exchangers for Microstructures
US 08485247 B2, July 16, 2013, Stacked plates or shells form interplate passages, Elena Daniela Lavric / Corning Incorporated (Corning, US)
A multiple-layered microfluidic device comprising at least a first fluid path…

Heat Radiating Fin Assembly and Thermal Module Formed Therefrom
US 08464779 B2, June 18, 2013, Air cooled, including fins, Sheng-Huang Lin / Beijing AVC Technology Research Center Co., Ltd. (Beijijng, CN)
A heat radiating fin assembly, comprising:…

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