Featured patents

Systems and Methods for Cleaving a Bonded Wafer Pair
US 08845859 B2, Sept. 30, 2014, Piercing layer during delaminating, Dale A. Witte et al. / SunEdison Semiconductor Limited (UEN201334164H) (Singapore, SG
A system for cleaving a bonded wafer pair having a first face and a second…

Mask, Method of Manufacturing Mask and Apparatus for Manufacturing Mask
US 08778115 B2, July 15, 2014, With stretching, Choong-Ho Lee et al. / Samsung Display Co., Ltd. (Gyeonggi-Do, KR)
A method of manufacturing a mask, the method comprising:…

Method for Producing Molded Body
US 08758545 B2, June 24, 2014, By curing of nonfully polymerized self-sustaining lamina, Daisuke Miwa et al. / Mitsubishi Heavy Industries, Ltd. (Tokyo, JP)
A method for producing a molded body, the method comprising:…

Bond Line Control Process
US 08734604 B2, May 27, 2014, Reclaiming, renewing or repairing articles for reuse, Michael W. Evens et al. / The Boeing Company (Chicago, US)
A method for bonding parts, the method comprising:…

Installation System for Quickly Attaching Fastening Elements by Means of Light-Curing Adhesives
US 08663417 B2, March 4, 2014, To polymerize or cure material in work, Frank Braun / nie wieder bohren ag (Hanau, DE)
A fastening element for mounting stationary objects, wherein the fastening…

Method for Joining Pipes and Junction Structure for Joining Pipes
US 08632646 B2, Jan. 21, 2014, With sonic or ultrasonic treatment, Naoki Suigetsu / Olympus Corporation (Tokyo, JP)
A method for joining pipes in which a first pipe and a second pipe…

Automated Material Removal in Composite Structures
US 08568545 B2, Oct. 29, 2013, With measuring, testing, or inspecting, Lawrence S. Lindgren et al. / The Boeing Company (Chicago, US)
A method of restoring a composite structure containing an out-of-tolerance area,…

Low-K Damage Avoidance During Bevel Etch Processing
US 08500951 B2, Aug. 6, 2013, For detection or control of pressure or flow of etchant gas, Yunsang Kim et al. / Lam Research Corporation (Fremont, US)
An apparatus for etching a bevel edge of a substrate, comprising:…

System and Method for Continuously Manufacturing Liquid Crystal Display Device
US 08485241 B2, July 16, 2013, Lamina transferred to base from adhered flexible web or sheet type carrier, Satoshi Hirata et al. / Nitto Denko Corporation (Ibaraki-shi, Osaka, JP)
A system for continuously manufacturing a liquid crystal display device,…

Recovery of High Value Rubber From Tires
US 08465618 B2, June 18, 2013, Flash, trim or excess removal, Edward McMahon et al. / Rubber Recovery Solutions LLC (Chattanooga, US)
A method of recovering rubber from a manufactured tire, the tire comprising one…

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