Featured patents

Method for Producing a Vehicle Tire Tread
US 08852375 B2, Oct. 7, 2014, By extrusion, Christophe Bessac / Compagnie Generale des Etablissements Michelin (Clermont-Ferrand, FR)
Process for producing a tread for a vehicle tire, comprising the steps of:…

Apparatuses and Methods for Fabricating Elastomeric Laminates
US 08815035 B2, Aug. 26, 2014, Bonding of sheets or webs only, Uwe Schneider / The Procter & Gamble Company (Cincinnati, US)
A method for making an elastomeric laminate, the method comprising the steps of:…

Process and Apparatus to Foam a Water-Base Adhesive
US 08758533 B2, June 24, 2014, Foaming, Ottó Szilágyi / Henkel AG & Co. KGAA (Duesseldorf, DE)
A process for foaming a water-based adhesive comprising the steps:…

Method for Connecting Two Joining Partners
US 08702898 B2, April 22, 2014, Epoxy resin, Lothar Zapf / Vacuumschmeize GmgH & Co. KG (Hanau, DE)
A method for bonding a first bonding partner to a second bonding partner,…

Imaging Device and Imaging Device Manufacturing Method
US 08715444 B2, May 6, 2014, Subsequent to assembly of laminae, Yasutaka Tanimura et al. / Konica Minolta Holdings, Inc. (Tokyo, JP)
An imaging device manufacturing method, comprising:…

Transfer Method Using Thermal Transfer Film
US 08685191 B2, April 1, 2014, Direct contact transfer of adhered lamina from carrier to base, Hung-Jen Chen et al. / Compal Electronics, Inc. (Taipei, TW)
A transfer method, comprising:…

Bonding Method for Laminated Piezoelectric Element
US 08597457 B2, Dec. 3, 2013, Prior to assembly, Toyoki Tanaka et al. / Mitsumi Electric Co., Ltd. (Tokyo, JP)
A method of bonding a flat end surface of a pillar-shaped laminated piezoelectric…

Debonding Equipment and Methods for Debonding Temporary Bonded Wafers
US 08551291 B2, Oct. 8, 2013, Using direct fluid current against work during delaminating, Gregory George / Suss Microtec Lithography, GmbH (Garching, DE)
A debonder apparatus for debonding a temporary bonded wafer pair comprising…

Adhesive Injection Device
US 08496037 B2, July 30, 2013, Evacuated or fluid pressure chamber, Eisaku Nakao et al. / Shimadzu Corporation (Kyoto, JP)
An adhesive injection device for injecting an adhesive between laminate…

Multilayer Retaining Ring for Chemical Mechanical Polishing
US 08470125 B2, June 25, 2013, With wafer retaining ring, Steven M. Zuniga et al. / Applied Materials, Inc. (Santa Clara, US)
A retaining ring for a carrier head having a mounting surface for a substrate…

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