Featured patents

Optical Thin-Film Vapor Deposition Apparatus and Optical Thin-Film Production Method
US 08826856 B2, Sept. 9, 2014, Multiple gas energizing means associated with one deposition site, Tatsuya Hayashi et al. / Shincron Co., Ltd. (Kanagawa, JP)
An optical thin-film vapor deposition apparatus for vapor depositing a vapor…

Device for Applying Adhesive in a Slitter-Winder of Fiber Web Machine
US 08807066 B2, Aug. 19, 2014, With Cutting, Punching or Tearing of Work, Mikko Räikkönen / Valmet Technologies, Inc. (Espoo, FI)
A device for applying adhesive in a slitter-winder of a fiber web machine,…

Mask Frame Assembly for Thin Film Deposition and Method of Assembling the Same
US 08707894 B2, April 29, 2014, Work Surface Shields, Masks or Protectors, Yoon-Chan Oh et al. / Samsung Display Co., Ltd. (Yongin-si, KR)
A mask frame assembly for thin film deposition, the mask frame assembly…

Chamber and Film Forming Apparatus
US 08677925 B2, March 25, 2014, With Vacuum or Fluid Pressure Chamber, Tsuyoshi Shimizu / Ulvac, Inc. (Kanagawa, JP)
A vacuum chamber comprising:…

Film Formation Apparatus for Semiconductor Process and Method for Using the Same
US 08646407 B2, Feb. 11, 2014, Having prerecorded program medium, Hiroyuki Matsuura / Tokyo Electron Limited (Tokyo, JP)
A silicon nitride film formation apparatus, comprising:…

System and Method for Depositing Thin Layers on Non-Planar Substrates by Stamping
US 08631759 B2, Jan. 21, 2014, Expansible or contractible to effect work contract, Xiangfei Qi et al. / The Trustees Of Princeton University (Princeton, US)
An apparatus comprising:…

Simultaneous Electroless Plating of Two Substrates
US 08622020 B2, Jan. 7, 2014, With opposed relatively movable members acting on immersed work, Fritz C. Redeker et al. / Lam Research Corporation (Fremont, US)
An electroless plating system, comprising:…

In-Liquid Plasma Film-Forming Apparatus, Electrode for In-Liquid Plasma, and Film-Forming Method Using In-Liquid Plasma
US 08607732 B2, Dec. 17, 2013, Having glow discharge electrodes, Hidetaka Hayashi et al. / Kabushiki Kaisha Toyota Jidoshokki (Aichi-ken, JP)
An in-liquid plasma film-forming apparatus being characterized in that it has;…

Apparatus for VHF Impedance Match Tuning
US 08578879 B2, Nov. 12, 2013, Radio frequency antenna or radio frequency inductive coil discharge means, Kenneth S. Collins et al. / Applied Materials, Inc. (Santa Clara, US)
An impedance matching network, comprising:…

Substrate Liquid Processing Apparatus
US 08539906 B2, Sept. 24, 2013, With hood or offtake for waste material, Shuichi Nagamine et al. / Tokyo Electron Limited (Minato-Ku, JP)
A substrate liquid processing apparatus comprising:…

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